Materials Developed Specifically for Wafer Handling As a leader in technical ceramics for wafer processing equipment, CoorsTek understands advanced semiconductor manufacturing and constantly develops new materials, designs, and processes to optimize yields and extend product life. Their ultra-flat ceramic vacuum wafer chucks improve yield management for semiconductor wafer processing. Low-surface-contact configurations minimize risk of back-side particles negatively affecting wafer geometry for precision applications. We offer: • Ultra-flat capabilities • Exceptionally lightweight • Low thermal expansion • Extreme wear resistance • Mirror polish • High stiffness • Large size capability • 300mm and beyond Table 1. Advanced ceramic properties | | | Density | gm/cc | ASTM-C20 | 3.15 | 3.21 | 3.21 | 3.93 | | Color | - | - | Black | Black | Black | Ivory | | Flexural Strength (MOR), 20° C | MPa (psi X 103) | ASTM-F417 | 480 (70) | 468 (68) | 517 (75) | 400 (58) | | Elastic Modulus, 20° C | GPa (psi X 106) | ASTM-C848 | 410 (59) | 462 (67) | 434 (63) | 370 (54) | | Compressive Strength, 20° C | MPa (psi X 103) | ASTM-C773 | 3500
(507) | -
- | -
- | 2700
(390) | | Hardness | GPa (kg/mm2) | Knoop 100 gm | 26 (2650) | 27 (2750) | 27 (2750) | 14.1 (1440) | | Fracture Toughness, K (l c) | MPa m1/2 | Notched Beam | 4 | 3.5 | 3.5 | 4-5 | | Thermal Conductivity, 100° C | W/m °K | ASTM-C408 | 150 | 115 | 115 | 30.0 | | CTE, 20° C– | 1X 10-6/ °C | - | 2.1 | 2.1 | 2.1 | 6.1 | | Thermal Shock Resistance, ΔTc | °C | NOTE 3 | 300 | - | - | 200 | | Maximum Use Temperature | °C | NO-LOAD COND. | 1600 | 1600 | 1600 | 1750 | | Volume Resistivity, 25° C | Ohm-cm | ASTM-D1829 | < 105 | > 106 | < 0.10 | > 1014 | | Volume Resistivity, 500° C | Ohm-cm | ASTM-D1829 | < 103 | - | - | 1 x 1011 | | Volume Resistivity, 1000° C | Ohm-cm | ASTM-D1829 | < 103 | - | - | 3 x 106 | |
| Note: The chart is intended to illustrate typical properties. Engineering data is representative. Property values vary somewhat with method of manufacture, size, and shape of part. Any suggested applications are not made as a representation or warranty that the material will ultimately be suitable for such applications. The customer is ultimately responsible for all design and material suitability decisions. Data contained herein is not to be construed as absolute and does not constitute a representation or warranty for which CoorsTek assumes legal responsibility. ANY WARRANTY OR REPRESENTATION FOR WHICH COORSTEK IS RESPONSIBLE SHALL BE SUBJECT TO A SEPARATELY NEGOTIATED AGREEMENT. |
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Figure 1. Zygo flatness report – one of several tools CoorsTek uses to test and measure precision geometry High-Purity Materials Expertise From powder production and basic forming to precision finishing and measurement, CoorsTek produces high-quality, top-performance components. You’ll find CoorsTek materials: • Reduce the effect of particulate contamination • Offer ultra-clean purity • Minimize wafer contact • Resist corrosion in aggressive chemical cleaning Applications Typical applications: • Lithography • Inspection • Wafer cleaning • Non-vacuum process chambers |