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Topics Covered
Introduction
Our Most Popular Flexibilized
and Toughened Systems
Master Bond Flexibilized and
Toughened Systems are Used in a Wide Range of Applications
High Reliability and Performance
Packaged the Way
You Need It
Newest Grades Of Flexibilized and Toughened
Adhesive, Sealant and Coating Systems
About Master
Bond
Master Bond
Inc. has developed the widest variety of flexibilized and toughened epoxies, silicones, polyurethanes,
polysulfides and UV cures for
special application requirements. These compounds offer high peel/shear
strength, enhanced resistance to vibration, impact, shock and thermal cycling
and serviceability at low/cryogenic to high temperatures. Adhesion to dissimilar
substrates is outstanding.
These formulations vary in viscosity, cure times, electrical properties,
colors, temperature and chemical resistance. Both one and two component systems
are available for use.
Specific grades offer:
- Electrical and Thermal Conductivity
- NASA Low Outgassing Approval
- Superior Electrical Insulation Properties
- Outstanding Water and Chemical Resistance
- Cryogenic Serviceability
- Optical
Clarity
- Easy Repairability
- Low Stress
- Adjustable Volume Resistivity
- Low Shrinkage
- High Dielectric Strength
- Low Dielectric Constant
- Gap-Filling
- High Temperature Resistance
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Master
Bond's popular flexibilized and toughened systems are given below.
| Product |
Description |
| EP21TDC-7 |
Highly flexible two part room temperature curing
systemwith outstanding adhesion to most rubbers. Shore D hardness of 30-35. High
peel strength of 40pli @ 75°F and an elongation of >400% ast
75°F. |
| EP21TPLV |
Two part, room temperature curing polysulfide for bonding, coating, sealing and
casting. Exceptionally tough. Service temperature range of -80°F to 250°F. One
to one mix ratio. Shore D hardness of 35/40. |
| SUPREME 10HT |
One part, no-mix, heat cured epoxy system with high toughness. Outstanding
heat and thermal cycling resistance. High peel and shear strength. Service
operating temperature range of 4K to 400°F. |
Master
Bond flexibilized and toughened systems are used in applications
including:
- For the bonding and sealing of a variety of substrates which
exhibit different coefficients of thermal expansion
- Impact and vibration resistance
- General purpose thermal cycling
- Boroscopes and doublets
- Thermistors
- Various gasketing applications
- A low modulus, low stress seal
- Attaching guide wires and catheter balloon bonding
- Protection of CSPs from mechanical shock and vibration
- For use in select spacecraft electronic applications
- In vacuum impregnation where rigid epoxy would be inappropriate
- For the bonding of delicate parts or parts where stress may be
encountered
- Excellent adhesion to many metal, plastic, glass, and rubber
substrates.
- For the bonding, sealing, and potting of sensitive optical components
- For encapsulating intricate electrical and electronic components
- For the encapsulation of heat-generating devices and modules
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- For bonding of stress sensitive devices. Piezoelectric and micro-machined sensors
- Sound dampening
- To provide low stress on surface mount components
- For assembly of flexible circuits
- Solder replacement in select situations
- Assembling heating elements
- For attaching heat sinks to electrical components
- For the potting of transformers and inductors
- Bonding flexible substrates and connectors
- Encapsulating coils, potentiometers and modules
- Cable joints/terminations
- Optoelectronic transceiver modules
- Bonding of semiconductor, capacitor, and resistor chips in
micro and optoelectronic hybrid circuit fabrication
- To mold and cast cable connectors, harness assemblies, wiring,
and other elastic components
|
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Master
Bond's flexibilized and toughened systems are designed to offer superior
quality and long term durability. They have earned a well deserved reputation
for their performance upon exposure to hostile environmental conditions. Select
from a wide range of systems conveniently packaged for ease of use. These
compounds are available in different viscosities, cure times, chemical
resistances, electrical properties, colors, etc. to best meet specific
requirements. They are presently employed in applications ranging from design
and production to repair, maintenance and field service.
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We offer a wide array of packaging options to speed productivity, minimize waste and
save energy including:
- Quantities from grams to gallons
- Cans, bottles and jars
- Cartridges for manual and pneumatic guns
- Premixed and frozen syringes
- Bipaks for field service kits
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Master
Bond's newest grades of flexibilized and toughened adhesive, sealant and
coating systems are given below.
| Product |
Description |
| EP21TDC-2 |
Exceptional flexibility and high peel strength.
Elongation over 150%. Cures at room temperature. Low exotherm during cure.
Serviceable at cryogenic temperatures. |
| EP37-3FLF |
Low viscosity, optically clear, room temperature
curing, two component epoxy system. Resists severe
thermal cycling and shock. Long working life. Bonds well to similar and
dissimilar substrates. |
| EP21FL |
Toughened epoxy stem cures at room temperatures. Bonds well
to dissimilar substrates with different coefficients of expansion and
contraction. Exceptional vibration, impact and shock resistance. Excellent
electrical insulation properties. |
| EP79FL |
Silver coated, nickel filled, electrically
conductive epoxy adhesive. Superior
toughness. Very low volume resistivity. Cures at room temperature. Convenient
one to one mix ratio. |
Master
Bond is a leading adhesive manufacturer offering high quality adhesives,
sealants, coatings, and potting compounds. Master Bond's
product line consists of epoxy adhesives, polyurethane,
silicone,
cyanoacrylate and latex adhesives.
Master
Bond's structural adhesives offer design flexibility and provide excellent
bonding performance with a vast array of 3,000 custom designed adhesive
formulations. Adhesive properties differ in viscosity, cure speed, chemical and
temperature
resistance, strength, electrical and thermal
conductivity.
Specific adhesive systems can be designed to meet USP Class VI certification
for medical
use or NASA requirements for low outgassing. Master Bond
products are successfully implemented in medical, optical, aerospace, electronic,
and other hi-tech industries.
Source: Master Bond Inc.
For more information on this source please visit Master Bond Inc.