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Topics Covered
Background
Introduction
Master Bond High Viscosity Non-Drip Epoxy, Polyurethane, Silicone,
Polysulfide and UV Cure Systems
Applications of High
Viscosity Non-Drip Epoxy, Polyurethane, Silicone, Polysulfide and UV Cure
Systems
Reliability and Performance of High Viscosity
Non-Drip Epoxy, Polyurethane, Silicone, Polysulfide and UV Cure Systems
New Epoxy Non-Drip Adhesives
Electronic Grade Polymers for Electronic Manufacturing by Master Bond
| Epoxies are the most widely used
polymeric materials for adhesives, sealants, coatings, pottings and
encapsulations and impregnants. They are available in both one and two
component systems. Two part systems can be cured at either room temperature
or elevated temperature. One part systems must be cured at elevated
temperatures (typically 250 - 300°F). One part systems curable by
UV light are also available.
Silicones are elastomeric systems with the unique combination
of flexibility and high temperature resistance. They can be used as
adhesives, sealants, coatings and potting materials. Silicone systems
are either one or two part. One part systems cure by moisture in the
air. Two part systems are cured by the polymerization reaction that
occurs when a curing agent is added. Generally, the two part systems
can cure in thicker sections than the one part systems.
|
Background
Adhesive
manufacturer Master Bond Inc offers over 3,000 different grades of
specially designed formulations. They differ in viscosity, cure speed,
temperature resistance, chemical resistance, strength, electrical properties,
color etc. These products are specifically designed to solve design,
manufacturing and repair/maintenance problems. They will increase productivity,
reduce waste, save energy and improve your products performance. They are the
perfect solution.
Introduction
Master
Bond high viscosity non-drip epoxy, polyurethane, silicone, polysulfide and
UV cure systems can be applied on vertical surface without sagging. They also
have superior gap-filling properties.
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Specific grades offer:
- Abrasion resistance
- Chemical resistance
- Cryogenically serviceable
- Easily polished
- Easily removed by water
- Reworkable
- Impact resistance
- Screen printable
- Spectral transmittance
- Peel strength
- Easily repairable
- Electrically insulative
- Excellent adhesion
- Mechanical properties
- Vibration resistance
|
- Dimensionally stability
- Optical transmission
- High temperature resistance
- Index of refraction
- Low coefficient of expansion
- Shock resistance
- Thermal conductivity
- Low shrinkage
- Low stress
- Shock resistance
- Non-yellowing
- Resistance to water
- Durability
- Thermal cycling
- Low outgassing
|
Master Bond High Viscosity Non-Drip Epoxy, Polyurethane, Silicone,
Polysulfide and UV Cure Systems
The following table summarizes Master Bond's
range of high viscosity non-drip epoxy, polyurethane, silicone, polysulfide and
UV cure systems.
| Product |
Description |
| EP21ND |
Two part, room temperature curing epoxy. Convenient 1:1 mix ratio.
Non-drip/non-sag on vertical surfaces. Excellent electrical insulator with
outstanding mechanical properties. |
| SUPREME
10HTND2 |
Heat cured, toughened, one part non-drip formula with exceptional shear and
peel strength. Service temperature range of -320°F to 400°F. Resists vibration,
shock and impact. |
| EP21TPND |
Two component polysulfide, room temperature curing non-drip paste for high
performance, bonding and sealing. Resistant to thermal cycling and
chemicals. |
Applications of High Viscosity Non-Drip Epoxy, Polyurethane, Silicone,
Polysulfide and UV Cure Systems
Master
Bond high viscosity non-drip epoxy, polyurethane, silicone, polysulfide and
UV cure systems are used in applications including:
- Non-drip epoxies
- Vertical and overhead application
- Filling of large gaps
- For industrial adhesive, staking, laminating, repair and manufacturing
applications
- As a gap sealant in oil, gas, pressure and water tanks
- Bonding of heat tubes/sink joints
- Yielded joints and profiled joints on a component
- Assembly of hi-tech machinery
- Overhead and vertical machinery applications
- Bonding and sealing joints
- Bonding voice coils in the assembly of speakers
- Bonding end caps to filter media in assembly of filters
- Bonding bottom plates to tapping plates in the assembly of filters
- Bonding stainless steel screens to frames.
- In electronic, aerospace, and industrial applications where a high-fill,
non-sag adhesive is needed
- As a filler with: holes, castings, molds, etc.
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- Protection of impeller blades, gate valves, water boxes and fan blades
- Assembly of connectors, switches and other electrical components
- Bonding of molded high voltage terminals
- For sealing openings in modules or housings
- Wire and spot bonding applications requiring a non drip adhesive
- For bonding steel lining of oil well interior
- For setting injection ports
- Ceramic insulators and transformer housing
- As a protective coating for vertically oriented surfaces
- To reinforce honeycomb core for fastener attachments and for core edge fill
to prevent moisture ingression in composite parts.
- In electronic applications where a high fill, non-drip adhesive is needed
- Medical devices
- Bonding of compressors
- Bonding of magnet assemblies
- Battery bonding
- To seal and protect equipment exposed to erosion and corrosion
- To reduce turbulence, wear, and cavitation in pump casings and diffusers
|
| Polysulfides are versatile synthetic
elastomers which offer a unique set of application and performance properties
for a wide range of uses from aircraft fuel tank sealants and industrial
tank liners to electrical potting compounds and high performance adhesives,
coatings, etc. They are 100% reactive compounds which can be readily
cured at ambient or more quickly at elevated temperatures featuring
superior physical strength properties, chemical resistance especially
to fuels, lubricants, water, etc. as well as outstanding electrical
insulation properties.
|
Reliability and Performance of High Viscosity Non-Drip Epoxy, Polyurethane,
Silicone, Polysulfide and UV Cure Systems
Master
Bond's non-drip systems are designed to offer superior quality and long term
durability. They have earned a well deserved reputation for their performance
upon exposure to hostile environmental conditions. Select from a wide range of
systems conveniently packaged for ease of use. These compounds are available in
different viscosities, cure times, chemical resistances, electrical properties,
colors, etc. to best meet specific requirements. They are presently employed in
applications ranging from design and production to repair, maintenance and field
service.
New Epoxy Non-Drip Adhesives
Master
Bond has recently introduced several new epoxy non-drip adhesives. These
include:
| Product |
Description |
| EP21TCHT-1 |
Room temperature curing, thermally conductive, electrically insulative
adhesive. Serviceable from 4K to 400°F. Low thermal expansion coefficient. Meets
NASA low outgassing specifications. |
| EP21TDCS-LO |
Silver filled, room temperature curing epoxy has very low volume
resistivity. Easy to use, one to one mix ratio. Serviceable at cryogenic
temperatures. Passes ASTM 595 for NASA low outgassing. |
| Supreme
10AOHT |
One part, high shear, high peel strength epoxy adhesive. Thermally
conductive, electrically insulative. Serviceable from 4K to 400°F. Resistant to
vibration and thermal shock. |
| Supreme
10HTFS |
One component, no mix system. Snap cure adhesive. High purity, silver
conductive formulation. Service temperature range from 4k to 400°F.
|
Electronic Grade Polymers for Electronic Manufacturing by Master Bond
| UV curable compounds usually cure
in a matter of seconds when exposed to a suitable UV light source. Environmentally
friendly, they are 100% reactive liquids which do not contain any solvents
or other volatiles. Upon cure they exhibit minimal shrinkage. Additionally,
they are strong, durable, and offer superior temperature and chemical
resistance. If required, special formulations can be developed to best
meet specific product application and performance needs. One new "dual
cure" compound can be cured by exposure to either UV light or heat.
|
Master Bond’s
line of microelectronic formulations consists of epoxies, silicones, polyurethanes,
acrylics and latex solutions. They include electrically insulative, thermally
conductive and electrically conductive systems. Both one and two component compounds
are available for use. These products are currently employed in applications
ranging from heat sinking to glob tops to surface mounting. Many of these compounds
have unique properties such as low thermal expansion coefficients, exceptionally
high thermal conductivity, low stress, etc. Master
Bond is also actively engaged in developing new products to keep pace with
the rapid technological advancements in the microelectronic industry ranging
from flip-chip technology to advanced die-attach processes.
Master
Bond offers specialty systems for computers, telecommunications devices,
audio/video devices, avionics and aerospace applications, as well as automotive
manufacturing, interactive circuitry and advanced semiconductor equipment.
Source: Master Bond
For more information on this source please visit Master
Bond