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Topics Covered
Background
Introduction
Features of One Component Epoxy Underfill Compounds
Master Bond One Component Epoxy Underfill
Compounds
Applications of One Component
Epoxy Underfill Compounds
Reliability and
Performance of One Component Epoxy Underfill Compounds
Electronic Grade Polymers for Electronic
Manufacturing by Master Bond
Background
Adhesive
manufacturer Master Bond Inc offers over 3,000 different grades of
specially designed formulations. They differ in viscosity, cure speed,
temperature resistance, chemical resistance, strength, electrical properties,
color etc. These products are specifically designed to solve design,
manufacturing and repair/maintenance problems. They will increase productivity,
reduce waste, save energy and improve your products performance. They are the
perfect solution.
Introduction
Master
Bond has formulated a line of one component epoxy underfill compositions
which feature rapid cures at moderately elevated temperatures and offer
excellent underfill-to-die passivation as well as outstanding adhesion to a
variety of substrates. They exhibit remarkably fast cures of 25-30 minutes at
250°F or as little as 10-15 minutes at 300°F. Their shelf life at ambient
temperatures is a minimum of 3 months and a maximum of 6 months. These new
underfills are 100% reactive and do not contain any volatiles.
Features of One Component Epoxy Underfill Compounds
The new Master Bond line of epoxy underfills contains low viscosity,
highly flowable compounds that produce uniform void-free epoxy layers for enhancing
the protection of the active die surfaces and improve stress distribution away
from solder interconnects. Master Bond,
furthermore, has formulated no flow fluxing underfill whose use greatly simplifies
conventional flip chip assemblies, some of which can be fully cured during standard
reflux cycles in-line processing. Both highly insulative and thermally conductive
compounds are available. They all feature superior resistance to thermal temperature
cycling as well as to mechanical shock and vibration.
| Epoxies are the most widely used
polymeric materials for adhesives, sealants, coatings, pottings and
encapsulations and impregnants. They are available in both one and two
component systems. Two part systems can be cured at either room temperature
or elevated temperature. One part systems must be cured at elevated
temperatures (typically 250 - 300°F). One part systems curable by
UV light are also available.
|
- High Reliability
- High-Purity
- Improved Toughness
- Low Stress
- Low Shrinkage
- Excellent Adhesive Properties
- Outstanding Electrical Insulation
- Superior Thermal Conductivity
- High Temperature Resistant
- Environmentally Friendly
- Withstands Thermal Cycling
- Easily Dispensed
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Master Bond One Component Epoxy Underfill Compounds
The following table summarizes Master Bond's
range of one component epoxy underfill compounds.
| Product |
Description |
| EP3RRLV |
One part oven cured system (125-150°C) for underfills & flip chips, good
dimension stability and very easy to use. Cures rigid. |
| EP30AO |
Two part room temperature curing system with good flow, excellent dimension
stability and strength properties. For underfills and flip chip. Cures
rigid. |
| EP37-3FLF |
Two part room temperature curing system for flip chip applications with
excellent flexibility and low viscosity. |
Applications of One Component Epoxy Underfill Compounds
Typical applications of Master Bond's range of one component epoxy underfill compounds
include:
|
Electronics Manufacturing
- Semiconductor Devices
- Passive Filters
- Detector Arrays
- Micro Electro-Mechanical Systems
- Electronic Watches
- High Speed Microprocessors
- Computer Control Processors
- Microprocessors
- Digital Signal Processors
- Smart Cards
- Driver Chips
- LCDs
- Surface Acoustic Waves
Telecommunication Devices
|
Automotive Electronics
Aerospace Applications
- Spectrometers
- Shutters/Filters
- Bolometers
- Propulsion and Active Mechanical/ Thermal Control Systems
Medical Devices
- MRI Machines
- Electro Cardiograms
- Hearing Aids
- X-Ray & Imaging Equipment
Electro-Optical Applications
- Electro-Optical Sensory Devices
- Electro-Optical Transceiver Systems
|
Reliability and Performance of One Component Epoxy Underfill Compounds
Master
Bond's Flip-Chip/Underfill Systems are designed to offer superior quality
and long term durability. They have earned a well deserved reputation for their
performance upon exposure to hostile environmental conditions. Select from a
wide range of systems conveniently packaged for ease of use. These compounds are
available in different viscosities, cure times, chemical resistances, electrical
properties, colors, etc. to best meet specific requirements. They are presently
employed in the assembly of many critical electronic devices used in commercial,
military, space and medical applications.
Electronic Grade Polymers for Electronic Manufacturing by Master Bond
Master
Bond’s line of microelectronic formulations consists of epoxies, silicones,
polyurethanes, acrylics and latex solutions. They include electrically
insulative, thermally conductive and electrically conductive systems. Both one
and two component compounds are available for use. These products are currently
employed in applications ranging from heat sinking to glob tops to surface
mounting. Many of these compounds have unique properties such as low thermal
expansion coefficients, exceptionally high thermal conductivity, low stress,
etc. Master
Bond is also actively engaged in developing new products to keep pace with
the rapid technological advancements in the microelectronic industry ranging
from flip-chip technology to advanced die-attach processes.
Master
Bond offers specialty systems for computers, telecommunications devices,
audio/video devices, avionics and aerospace applications, as well as automotive
manufacturing, interactive circuitry and advanced semiconductor equipment.
Source: Master Bond
For more information on this source please visit Master
Bond