Master Bond Adhesives for OEM Applications - Advanced Solutions by Master Bond Inc.

Topics Covered

Introduction

OEM manufacturers worldwide chose Master Bond adhesives, sealants and coatings for their advanced adhesive needs. Master Bond OEM solutions are specifically formulated for the high efficiency and high performance needs of the OEM industry, allowing for high throughput and processing rates with no compromise in quality.

Master Bond OEM systems are widely employed by manufacturers seeking increased productivity. They are designed to speed assembly, lower energy cost, reduce waste and improve product performance. Both one and two component systems are available for use. The one part systems require no mixing and cure upon exposure to heat or UV light. Two part systems cure at ambient temperature or upon exposure to slightly elevated temperatures.

Specific Grades

The specific grades of adhesives for OEM applications include:

• Improved durability
• Abrasion resistance
• High physical strength properties
• Gap-filling
• Fast cures
• Easy processing
• Low stress
• NASA low outgassing approval
• Thermal and electrical conductivity
• Superior electrical insulation properties
• Resistance to vibration, impact, shock and thermal cycling
• Withstand exposure to a wide range of chemicals and water
• High bond strength to similar and dissimilar substrates
• Comply with UL94V-0 flame retardant specification

Major Applications

Some of the applications of adhesives are listed below:

Rapid Curing Adhesives

Rapid curing adhesives are essential in many OEM assembly applications. Single component, no-mix epoxies are gaining popularity over traditional two component systems. They are easy to apply and speed productivity. Often two part epoxies have complicated mix ratios, limited pot lives and long processing times. One part systems are pre-catalyzed and require only moderate heat to cure, effectively alleviating inaccurate mixing and eliminating wastage from non-use of compounds in specified time periods. Additionally,, the speed of cure is rapid, often faster than two part systems.

The performance profile of one part epoxy systems is truly outstanding. These formulations exhibit high physical strength, superior chemical and temperature resistance and excellent adhesion to both similar and dissimilar substrates. They have extremely low shrinkage upon cure and resist exposure to thermal cycling. Grades are available which have superior thermal conductivity, electrical conductivity and electrical insulation properties. Special compounds meet Mil Specs, NASA low outgassing specifications and are USP Class VI approved.

Major Epoxy Performance Requirements

Master Bond epoxies are designed to meet specific performance requirements. Among the most important are:

Master Bond Polymer System EP65HT-1 for OEM Applications

Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85°C, EP65HT-1 has an amazing Tg of over 125°C. In addition, unlike the typical fast cure epoxies, EP65HT-1 retains fast setup times even when mixed in relatively small masses. EP65HT-1 normally will setup in 3-5 minutes in 10 to 20 gram masses. Full cure normally occurs within a few hours with exceptionally high tensile shear strengths approaching 3,000 psi. Service temperature range is -60°F to +400°F. EP65HT-1 offers superior electrical insulating properties and a strong chemical resistance profile. EP65HT-1 has now been qualified to meet NASA low outgassing specifications.

EP65HT-1 bonds well to a wide variety of substrates including metals, glass, ceramics, woods, vulcanized rubbers and many plastics. Dispensing of the EP65HT-1 has been tremendously facilitated by the development of a dispensing gun capable of mixing fast setting materials with a 10 to 1 mix ratio. As a consequence, EP65HT-1 is becoming widely used for both manufacturing and prototyping in the electrical, electronic, appliance, computer, optical, automotive and aerospace industries.

Packaging

Master Bond Inc. offers a wide selection of different packaging solutions to best meet your specific application requirements. They are designed to optimize dispensing of Master Bond compounds. Master Bond's innovative packaging solutions will maximize productivity, reduce waste and maintain consistently high product reliability. Packaging options are available for epoxies, polyurethanes, polysulfides, silicones, acrylics and UV cure systems. Additionally, special packaging is available for anaerobics, cyanoacrylates, latex systems and other resin formulations

About Master Bond

Master Bond is a leading adhesive manufacturer offering high quality adhesives, sealants, coatings, and potting compounds. Master Bond’s product line consists of epoxy adhesives, polyurethane, silicone, cyanoacrylate and latex adhesives. Master Bond’s structural adhesives offer design flexibility and provide excellent bonding performance with a vast array of 3,000 custom designed adhesive formulations. Adhesive properties differ in viscosity, cure speed, chemical and temperature resistance, strength, electrical and thermal conductivity. Specific adhesive systems are designed to meet USP Class VI certification for medical use or NASA requirements for low outgassing. Master Bond products are successfully implemented in medical, optical, aerospace, electronic, and other hi-tech industries.

Source: Master Bond

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