Toughened One Component Epoxy Bonds Heat Sensitive Substrates

Topics Covered

Introduction
Master Bond Supreme 3HT-80
Snap Cure Adhesives
Types of Snap Cure Adhesives
Cutting Edge Formulations
Outstanding Technical Support
Latest Technological Advancements
About Master Bond

Introduction

Master Bond Supreme 3HT-80 cures at 175°F (80°C) – well below the 250-300°F required by typical one component epoxies. It has a cure speed of 30 minutes at 175°F and 10 minutes at 250°F. It is well suited for bonding heat sensitive substrates.

Master Bond Supreme 3HT-80

Supreme 3HT-80 offers high shear and peel strength properties. It requires no mixing and has an “unlimited” working life. The adhesive spreads evenly, smoothly and is easy to apply. Supreme 3HT-80 is serviceable from -100°F to +350°F. Resistance to impact, thermal shock, vibration and stress fatigue cracking is exceptional.

Supreme 3HT-80 has excellent adhesion to similar and dissimilar substrates. It features superior chemical resistance and electrical insulation properties. It is dimensionally stable and has outstanding durability. 100% reactive Supreme 3HT-80 contains no solvents or volatiles.

Master Bond formulates a line of high performance one component epoxy systems to meet the needs of the electronic, aerospace, medical, optical, oil/chemical processing and electrical industries. Specific grades offer high/low temperature serviceability, electrical conductivity, flexibility/toughness, thermal conductivity, and chemical resistance. Master Bond also has developed snap cure systems to speed productivity in assembly line applications. 

Snap Cure Adhesives

Cutting edge snap cure adhesives facilitate speedy productivity and feature convenient handling. These single component systems require no mixing and are designed to cure rapidly at moderate temperatures. Their short cure cycle results in energy and cost savings. Available for use in a variety of viscosities, these compounds are easy to apply and offer excellent bond strength. Additionally, they have superior resistance to adverse environmental conditions.

Types of Snap Cure Adhesives

Master Bond offers a full line of snap cure adhesives with properties including:

  • Electrically conductive
  • Thermally conductive
  • Electrically insulative

Cutting Edge Formulations

Master Bond’s product line consists of advanced epoxies, silicones, polyurethanes, polysulfides, UV/LED cures and other specialty systems. Each compound is designed tomeet specific application requirements. Master Bond’s environmentally friendly systems are available in convenient packaging from small to large sizes.

Outstanding Technical Support

With years of experience in technical support, the Master Bond team will be able to assess your application and recommend the most suitable polymer system to meet your specifications. Master Bond will continue to guide you throughout the design, prototype and manufacturing process. Master Bond offers replacements for discontinued products.

Latest Technological Advancements

As a worldwide manufacturer of polymer compounds, Master Bond is continuously working with universities and R&D labs to improve product performance. Master Bond products are designed to maximize productivity, reduce waste, save energy and for dependable, long term durability.

About Master Bond

Master Bond is a leading adhesive manufacturer offering high quality adhesives, sealants, coatings, and potting compounds. Master Bond’s product line consists of epoxy adhesives, polyurethane, silicone, cyanoacrylate and latex adhesives. Master Bond’s structural adhesives offer design flexibility and provide excellent bonding performance with a vast array of 3,000 custom designed adhesive formulations.

Adhesive properties differ in viscosity, cure speed, chemical and temperature resistance, strength, electrical and thermal conductivity. Specific adhesive systems can be designed to meet USP Class VI certification for medical use or NASA requirements for low outgassing. Master Bond products are successfully implemented in medical, optical, aerospace, electronic, and other hi-tech industries.

Source: Master Bond

For more information on this source please visit Master Bond.

Date Added: Jul 27, 2012
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