The PresiCut S1000 is a Micro Precision cut off machine for low deformation cutting.
The Low Speed Diamond saw is well established in the materials laboratory for cutting and sectioning a wide variety of small and delicate samples particularly when the material structure is not homogeneous.
The PresiCut S1000 gives a high quality cut surface without serious deformation and with minimum burr. The universal design uses thin diamond/CBN bonded wafering blades to cut fragile and soft sample that cannot be handled by high speed abrasive/diamond cutting machines.
A range of sample holders have been designed for this purpose including a rotating holder for round material. The speed of the wafering blades can vary between 50 and 1000rpm for optimum cutting conditions.
Standard set includes, free weights, sample holder and splash guard.