Oxford Instruments' FlexAL product family provides a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single system to deliver:
- Maximum flexibility in the choice of materials and precursors
- Low-temperature processes enabled by plasma ALD
- Low damage maintained by the use of remote plasma
- Controllable, repeatable processes via recipe-driven software interface
Processes
Standard processes available on the FlexAL systems include:
- Al2O3 remote plasma process - down to room temperature deposition
- HfO2 high-k dielectric remote plasma process
- HfO2 high-k dielectric thermal ALD process
- TiN remote plasma process