The Centar Frontier is a computer-controlled polishing platform that integrates microscope, CCD camera and image processing to fully automate sample preparation, re x-section (SEM, SCM) and thinning in plain view or x-section (TEM/STEM) applications.
Key features of the Centar Frontier computer-controlled polishing platform include:
- Site specific cross-sectioning — SEM/SCM/X-Ray
- Thinning to any desired thickness — TEM/STEM
- Frontside/delayering — layer by layer — SEM/electrical
- Backside thinning to any desired thickness
- Shallow bevel — 3D angle control (SRM)
The Outcome - High throughput, high repeatability & high success rate by any user despite the technical challenge.
Site specific cross-sectioning - SEM/SCM/X-Ray
- 0.1µm accuracy
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No minimum size (<1mm)
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Any type of sample (die, package)
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Any type of material (ceramic, organic, Si, GaAs, Polyamid, Cu)
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Using SMPT patented image processing
Thinning to any desired thickness - TEM/STEM
- Using edge to edge algorithms
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Pre-FIB, Pre-Ion Mill, Wedge - 3mm
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Plan view or X-section
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Batch samples — up to 12
Frontside/delayering - layer by layer - SEM/electrical
- Automatic POI image saving
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Automatic stitching
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Increments as short as 0.2sec
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Delayer edges and corners
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No minimum sample size
Backside thinning to any desired thickness
- Automatic process by selecting thickness target
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PEM prep
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Backside SIMS prep - <2-µm
Shallow bevel - 3D angle control (SRM)
- EAC - Exact Angle Accuracy - 0.003deg