EOTPR 5000 - Fault Isolation and Interconnect Inspection of Advanced IC Packages

Electro Optical Terahertz Pulse Reflectometry (EOTPR), developed by TeraView, is an innovative terahertz-based time domain reflectometry (TDR) technology ideal for fault isolation and interconnect inspection of advanced IC packages.

TeraView’s proprietary EOTPR technology is used by the EOTPR 5000 to detect interconnect quality with the full automation, rapid measurement speed, and high throughput needed in the currently existing high volume manufacturing environments. Additionally, it is considered to be the only IC interconnect inspection technique currently available that works at the forefront of location accuracy and detection sensitivity.

The advanced IC packages currently available are susceptible to warpage-induced interconnect failures, including conditions such as head-in-pillow defects that occur in Package-on-Package (PoP) devices. These marginal or weak interconnect conditions may not be captured by electrical or logic testers.

The superior sensitivity and accuracy of the EOTPR 5000 can be used to detect minute shifts in impedance from weak or marginal interconnects after accelerated life or high temperature cycle tests. In this manner, it is possible to reduce manufacturing variations, improving packaging-related yields.

Product Features

The key features of the EOTPR 5000 are as follows:

  • Supports SECS/GEM factory automation interfaces
  • Compatible with BGA’s in the range of 400 µm to 1 mm
  • Fully automated device binning capability
  • Fully automated probing, recipe creation and service/maintenance mode
  • A full software suite to enable data collection and analysis
  • Automatic probe calibration to determine the position of the signal and ground probe tips

TeraView EOTPR 5000

Fully Automated Advanced IC Packaging Inspection System

System Specifications

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Dimensions (LxWxH) 96 x 213 x 170 cm (excluding JEDEC tray loader)
Weight (approximate) 1000 kg
Electrical Power Requirements 1 x 32 amp, 220 volt supply
Compressed Air Requirements 1 x at 60 – 80 psi

EOTPR Capabilities

EOTPR pulse rise time 6 ps (based on processed data) Defined as the time for the reflected impulse from the end of the high frequency probe to rise from 10% to 90% of its maximum value
Accuracy Able to locate a feature on 50 Ω coplanar waveguide positioned close to the high frequency probe with precision of ± 5 µm
Range Up to 200 mm from contact with probe in a typical package
Input Impedance 50 Ω nominal
Channel Input Connector 1 mm

Fully Automated Features

Modes of operation Full automated probing, recipe creation and service/maintenance mode
Probe type Compatible with commercially available high frequency probes
BGA pitch Supports BGA pitches from 400 µm to 1 mm
Probe calibration Automatic probe calibration
Device under test dimensions Minimum: 5 mm x 5 mm
Maximum: 35 mm x 35 mm
Device handling Devices are loaded on to the system via JEDEC trays
Device identification 2D barcode reader
Minimum BGA diameter 200 µm
Measurement time per pin 0.5 seconds
Software A full software suite will be provided to enable data collection and analysis
Software operating system Windows Server 2012
Integration with factory automation Software can be tailored to meet customer specific factory automation requirements
Environment Class 10,000 clean room compliant Operating temperature range: 18 °C (64 °F) – 30 °C (86 °F)
Temperature stability ±2 °C
Operating humidity: 20 – 80%
(non condensing)
EMC Compliant with SEMI standard E33
SEMI standard compliance System is compliant with SEMI standards S2, S8, and E33

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