Posted in | Physical Properties Testing | Plasma Processing | Plasma Processing Equipment

等離子體刻蝕系統 - Sirus T2的桌面活性離子蝕刻（RIE）TRION技術

TRION技術 Sirus T2的活性離子蝕刻（RIE）是一個基本的等離子體刻蝕系統設計需要氟基化學蝕刻介質和其他電影。小尺寸和堅固的設計，使實驗室環境的理想選擇。

應用

Sirus T2的活性離子蝕刻機的標準功能

Last Update: 3. October 2011 18:04

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