The Optofab3000 includes high reflective and anti reflective coatings and is configured similar to the Ionfab300Plus. The Optofab3000 offers all the features and advantages of the Ionfab300Plus with additional capabilities.
Key Features
The salient features of the Optofab3000 are:
- High-speed 8" specimen holder attached to the system
- Uniformity shields can be optionally used, offering layer uniformity improvements
- High rate of deposition can be achieved by using a 15 cm ion source
- By using an assist source, it is possible to achieve excellent refractive index results
- A white light optical monitor is optionally available with the patented holder of the Optofab3000
The Optofab3000 enables flexibility in a single tool. Its material handling features are:
- Handles from small pieces, through 100 mm or 4" up to 200 mm or 8" wafers
- Any shape can be clamped and distinct carrier plates can be designed
- Wafer handling options
- Load-lock for faster trials
- Manual loading for one-off trials
- Can be combined with other process tools such as Oxford Instruments' PlasmaPro
plasma etch, deposition and sputtering tools, and FlexAL atomic layer deposition (ALD) tools
- Cassette-to-cassette loading/unloading for batch production
- Can be easily upgraded to include deposition and etch sources
Optofab3000 Process Control Features
The key process control features of the Optofab3000 are:
- The substrate holder can be tilted from -90° up to +75°, which varies based on the configuration
- 'Blazed' gratings are enabled
- Sidewalls can be etched or cleaned off
- Angle control of substrate with respect to deposition target ensures excellent uniformity in deposition
- As the platen rotation speed can be varied, the deposition rate can be specifically controlled for the application
- High speed and standard platen options are available
- Degradation of substrate and devices structures or other materials is prevented
- Wafer backside cooling is possible with Ar (cryo-pump) or He (turbo-pump)
The key process monitoring features of the Optofab3000 are:
- Etch endpoint monitoring by SIMS for multi-material applications
- Deposition process monitoring using single or dual head crystal monitor and white light optical monitor (WLOM)
- Partial pressure control, chamber gas identification and leak checking via RGA
Standard Applications and Materials
The standard applications of the Optofab3000 are:
- VOx deposition and etch
- IR detectors
- CdHgTe (CMT) etch
- AR and HR coatings for laser bars
- III-V photonics etching
- Metal contact and track etch
- Diffraction gratings
- Thin film magnetic hard disk heads (TFMH)
- SiO2 'blazed' etch
- Spintronics and MRAM
- Telecom filters
The standard materials used in the Optofab3000 are
- Cu, Ni, Al...
- Noble metals: Au, Pt, Pd...