Electronics News RSS Feed - Electronics

Complex, Scalable Arrays of Semiconductor Heterojunctions Hold Potential for Future Electronics

Complex, Scalable Arrays of Semiconductor Heterojunctions Hold Potential for Future Electronics

A team of researchers at the Oak Ridge National Laboratory, Department of Energy, has integrated a new synthesis process with standard electron-beam lithography methods to create complex and scalable arrays of semiconductor heterojunctions in random patterns within a nanometer-thick semiconductor crystal. This unique process depends on converting patterned areas of a single-layer crystal into another layer of crystal. The study has been published in Nature Communications. [More]
Wireless, 3D-Printed Smart Cap Detects Spoiled Food Using Embedded Sensors

Wireless, 3D-Printed Smart Cap Detects Spoiled Food Using Embedded Sensors

A team of engineers from UC Berkeley along with colleagues at Taiwan’s National Chiao Tung University has further extended the scope of 3D printing technology by using the novel technique to create electrical parts such as capacitors, inductors, resistors, and integrated wireless electrical sensing solutions. [More]
Molybdenum Disulfide Holds Promise as Material for LED Manufacture

Molybdenum Disulfide Holds Promise as Material for LED Manufacture

Researchers from the California NanoSystems Institute at UCLA have successfully established electroluminescence from multilayer molybdenum disulfide (MoS2) for the first time. [More]
“White Graphene” Structures Could Prevent Over-Heating in Future Electronics

“White Graphene” Structures Could Prevent Over-Heating in Future Electronics

Researchers at Rice University have discovered that 3D structures of boron nitride, sometimes called "white graphene", could be used to control heat flow in small electronic devices. [More]
Oxford Instruments PlasmaPro® Systems Ordered by Chinese HB-LED Manufacturer

Oxford Instruments PlasmaPro® Systems Ordered by Chinese HB-LED Manufacturer

High tech Chinese manufacturer, Enraytek Optoelectronics Co has recently ordered several leading edge Oxford Instruments PlasmaPro 800 PECVD systems for the manufacture of their High Brightness LEDs. [More]
Nordson ASYMTEK to Display New Programmable Tilt + Rotate 5-Axis Fluid Dispenser at SEMICON West 2015

Nordson ASYMTEK to Display New Programmable Tilt + Rotate 5-Axis Fluid Dispenser at SEMICON West 2015

Nordson ASYMTEK, a Nordson company, a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. [More]
Black Phosphorus Could Emerge as Strong Contender to Silicon

Black Phosphorus Could Emerge as Strong Contender to Silicon

Researchers from McGill University and Université de Montréal have suggested that black phosphorus could emerge as a strong contender to silicon as it allows more transistors to be packed on a chip. [More]
ClassOne Launches Fully-Automated Solstice S4 Mid-Sized Electroplater

ClassOne Launches Fully-Automated Solstice S4 Mid-Sized Electroplater

Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice® family of ≤200mm wafer electroplaters. The fully-automated, cassette-to-cassette Solstice S4 is available with up to 4 chambers and can deliver up to 75wph throughput. In footprint, capacity and cost, the S4 is positioned between the manual-load, development-oriented Solstice LT, with 1 or 2 chambers, and the fully-automated Solstice S8 electroplater with up to 8 chambers. [More]
SEMICON West 2015: Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

SEMICON West 2015: Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. [More]
Leading Taiwan OSAT Adopts Zeta Instruments Metrology System for Advanced Semiconductor Manufacturing

Leading Taiwan OSAT Adopts Zeta Instruments Metrology System for Advanced Semiconductor Manufacturing

Zeta Instruments Inc., announced today that a leading Taiwan based outsourced semiconductor assembly and test (OSAT) ordered its third Zeta-580™ automated metrology system for production monitoring of advanced semiconductor packaging, including 2.5D interconnect and fan-out wafer level packaging (FOWLP). [More]