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Keithley Instruments Announce New Programmable DC Power Supplies

Keithley Instruments Announce New Programmable DC Power Supplies

Keithley Instruments, Inc., a world leader in advanced electrical test instruments and systems, today introduced the Series 2280S Precision Measurement, Low Noise, Programmable DC Power Supplies. Unlike conventional powe... [More]
Cadence Debuts Voltus-Fi Transistor-Level Electromigration and IR-Drop Solution

Cadence Debuts Voltus-Fi Transistor-Level Electromigration and IR-Drop Solution

Cadence Design Systems, Inc., a leader in global electronic design innovation, today introduced Cadence® Voltus™-Fi Custom Power Integrity Solution, a transistor-level electromigration and IR-drop (EMIR) solution that delivers foundry-certified SPICE-level accuracy in power signoff to create the fastest path to design closure. [More]
Flash Memory Summit 2014: AgigA Tech to Highlight Nonvolatile DIMM Technology

Flash Memory Summit 2014: AgigA Tech to Highlight Nonvolatile DIMM Technology

AgigA Tech Inc., a subsidiary of Cypress Semiconductor Corp. and a leading provider of high-speed, high-density, battery-free non-volatile memory solutions, will demonstrate its Nonvolatile DIMM (NVDIMM) technology in server and storage platforms at the Flash Memory Summit August 4-7, 2014. [More]
eASIC Reports Milestone Shipment of Ten Millionth ASIC

eASIC Reports Milestone Shipment of Ten Millionth ASIC

eASIC Corporation, a leading provider of Single Mask Adaptable ASIC™ devices today announced that it has shipped over ten million chips to date. The majority of the shipments are utilized in some of the fastest growing and dynamic markets. [More]
Global Flexible Electronics Market Forecast to Grow at 21.73% CAGR to Reach $13.23 Billion by 2020

Global Flexible Electronics Market Forecast to Grow at 21.73% CAGR to Reach $13.23 Billion by 2020

Global flexible electronics market is expected to reach $13.23 Billion by 2020 at an estimated CAGR of 21.73% with the number of applications using printing processes for flexible electronics forecast to grow at a good rate. [More]
USPTO Grants eSurface Multiple Patents for Process to Manufacture PCBs with Ultra-Fine Capabilities

USPTO Grants eSurface Multiple Patents for Process to Manufacture PCBs with Ultra-Fine Capabilities

eSurface® Technologies, the developer of the eSurface proprietary process for printed circuit boards, today announced it has been granted two patents by the United States Patent and Trademark Office. [More]
NIWeek 2014: Averna to Showcase Compact Solution for Automated Functional Product Testing

NIWeek 2014: Averna to Showcase Compact Solution for Automated Functional Product Testing

Averna will be exhibiting at NIWeek 2014, the industry's premier event on graphical system design, and participate in the opening keynote address. NIWeek 2014 begins August 4 at the Austin Convention Center in Austin, Texas, for three days of interactive technical sessions, case study presentations, and panel discussions on the latest advances in design, control, automation, manufacturing, and test. [More]
Visa Qualifies FIME to Perform Testing for Contactless EMV Analogue and Digital Specifications

Visa Qualifies FIME to Perform Testing for Contactless EMV Analogue and Digital Specifications

FIME has announced that its Montreal-based laboratory has been qualified by Visa to perform testing for its 'contactless EMV analogue and digital' specifications. This latest qualification supports handset manufacturers by enabling the leading payments consultancy and advanced testing provider to confirm compliance of near field communication (NFC) enabled mobile devices to the functional requirements laid out by the payment system. [More]
Orbotech to Provide Inspection, Testing and Repairs for CEC PANDA’S New Gen 8.5 Fab

Orbotech to Provide Inspection, Testing and Repairs for CEC PANDA’S New Gen 8.5 Fab

Orbotech Ltd. Orbotech Ltd., a global leader in advanced technology production solutions for flat panel display (“FPD”) manufacturing, announced today that TFT LCD panel maker Nanjing CEC Panda LCD Technology Co., Ltd. (a China Electronics Corp. company) has selected Orbotech as the inspection, testing and repair equipment vendor for its new Gen 8.5 fab in Nanjing, China. [More]
Advanced Semiconductor Joint Labs to Develop Semiconductor Technologies for Future Electronics Markets

Advanced Semiconductor Joint Labs to Develop Semiconductor Technologies for Future Electronics Markets

Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched today between A*STAR's Institute of Microelectronics (IME), and its 10 industry partners. [More]