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ClassOne Launches Fully-Automated Solstice S4 Mid-Sized Electroplater

ClassOne Launches Fully-Automated Solstice S4 Mid-Sized Electroplater

Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice® family of ≤200mm wafer electroplaters. The fully-automated, cassette-to-cassette Solstice S4 is available with up to 4 chambers and can deliver up to 75wph throughput. In footprint, capacity and cost, the S4 is positioned between the manual-load, development-oriented Solstice LT, with 1 or 2 chambers, and the fully-automated Solstice S8 electroplater with up to 8 chambers. [More]
SEMICON West 2015: Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

SEMICON West 2015: Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

Nordson MARCH, a Nordson company (NASDAQ: NDSN), a global leader in plasma processing technology, announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. [More]
Leading Taiwan OSAT Adopts Zeta Instruments Metrology System for Advanced Semiconductor Manufacturing

Leading Taiwan OSAT Adopts Zeta Instruments Metrology System for Advanced Semiconductor Manufacturing

Zeta Instruments Inc., announced today that a leading Taiwan based outsourced semiconductor assembly and test (OSAT) ordered its third Zeta-580™ automated metrology system for production monitoring of advanced semiconductor packaging, including 2.5D interconnect and fan-out wafer level packaging (FOWLP). [More]
Ultrafast Electron-Based Imaging Technique Holds Promise for Designing Improved Semiconductors

Ultrafast Electron-Based Imaging Technique Holds Promise for Designing Improved Semiconductors

Researchers at Michigan State University have developed an ultrafast electron-based imaging technique that makes it possible to modify the electronic properties of materials such that easy transmission of an electrical current is made possible. [More]
Argonne and UCLA Develop New Method to Create Magnetic Skyrmion Bubbles at Room Temperature

Argonne and UCLA Develop New Method to Create Magnetic Skyrmion Bubbles at Room Temperature

Researchers from the U.S. Department of Energy’s (DOE) Argonne National Laboratory (Argonne) and the University of California, Los Angeles (UCLA) have developed an innovative, simple method for creation of magnetic skyrmion bubbles at room temperature conditions. [More]
LEHVOSS’ New Generation Thermoplastic Shielding Compounds Demonstrate Outstanding Performance Against Electromagnetic Waves

LEHVOSS’ New Generation Thermoplastic Shielding Compounds Demonstrate Outstanding Performance Against Electromagnetic Waves

LEHVOSS North America, a subsidiary of Lehmann&Voss&Co, announces the introduction of LUVOCOM® ES, a new generation of thermoplastic shielding compounds with outstanding performance against electromagnetic waves and at smaller wall thicknesses. These new compounds are engineered for the housings of electric and electronic devices such as computers, radios, phones, and laboratory equipment. [More]
Leti Demonstrates New High-Brightness Micro-LED Array Fabrication Technology for Head-Mounted Displays

Leti Demonstrates New High-Brightness Micro-LED Array Fabrication Technology for Head-Mounted Displays

CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process. [More]
Researchers at Columbia Engineering Create the First Single-Molecule Diode

Researchers at Columbia Engineering Create the First Single-Molecule Diode

A new technique has been developed by a research team from Columbia Engineering in order to create the first ever single-molecule diode. [More]
Novel Electronic Devices Self-Destruct When Triggered By Heat

Novel Electronic Devices Self-Destruct When Triggered By Heat

Researchers at the University of Illinois (U. of I) have developed electronic devices that self-destruct when heated. This study was led by Scott R. White, an aerospace engineering professor at the U. of I. [More]

Picosun Provides ALD Solutions for IC, MEMS and LED Manufacturing Industries

Picosun Oy, the leading provider of high quality Atomic Layer Deposition (ALD) technology for global industries, reports winning important production markets in MEMS, LED, and other III-V compound semiconductor device ma... [More]