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Stanford Team Creates New Area-Selective ALD Process to Develop Energy Efficient Semiconductors

Stanford Team Creates New Area-Selective ALD Process to Develop Energy Efficient Semiconductors

Stanford University researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductor technologies, have developed a new area selective atomic layer deposition (ALD) process that promises to accelerate the manufacturing of higher performing, more energy efficient semiconductors. [More]
CPI Installs NovaCentrix PulseForge Photonic Curing System

CPI Installs NovaCentrix PulseForge Photonic Curing System

The Centre for Process Innovation (CPI) has recently partnered with NovaCentrix to install a specialist system designed for the high speed photonic curing of printed electronics inks. The NovaCentrix PulseForge 1300 state-of-the-art system is the first of its kind in the UK to be available to clients on an open access basis and will aid the commercialisation of a host of applications including printed sensing and Radio Frequency Identification (RFID) and Near Field Communication (NFC) antennas for smart packaging. The recent installation builds upon CPI’s existing capability for the market adoption of printed sensing technologies, allowing companies to develop and scale up their concepts from laboratory scale right through to pilot production. [More]
IEDM 2015: imec Demonstrates Integration of High Mobility InGaAs for 3D Vertical NAND Memory Devices

IEDM 2015: imec Demonstrates Integration of High Mobility InGaAs for 3D Vertical NAND Memory Devices

At this week’s IEEE IEDM conference, nano-electronics research center imec showed for the first time the integration of high mobility InGaAs as a channel material for 3D vertical NAND memory devices formed in the plug (holes) with the diameter down to 45nm. The new channel material improves transconductance (gm) and read current which is crucial to enable further VNAND cost reduction by adding additional layers in 3D vertical architecture. [More]
Flexible Water-Based Band-Aid with Embedded Electronics Faciltates Smart Drug Delivery

Flexible Water-Based Band-Aid with Embedded Electronics Faciltates Smart Drug Delivery

A futuristic band-aid has been developed that is sticky and stretchable whilst allowing electronics to be integrated into it. The band-aid consists of a hydrogel and can have LEDs and temperature sensors embedded into its structure. Microscale drug reservoirs and delivery channels can also be integrated into the band-aid which will allow the delivery of drugs in response to changes in body temperature or other biological signals such as blood glucose levels. [More]
MKM Starts Production of High-Purity, Oxygen-Free Copper Strip Using Conti-M Cast-Rolling Technology

MKM Starts Production of High-Purity, Oxygen-Free Copper Strip Using Conti-M Cast-Rolling Technology

MKM Mansfelder Kupfer- und Messing GmbH (MKM), Hettstedt, has begun the production of high-purity, oxygen-free copper strip (Cu-OFE). MKM is the only manufacturer in the world with the ability to produce this oxygen-free, hot-rolled copper strip in a continuous production process: our innovative Conti-M® cast-rolling technology makes it possible to cast, hot-roll, mill and coil copper strip in an uninterrupted process. [More]
EuroCPS Calls for Innovative Cyber-Physical System Projects

EuroCPS Calls for Innovative Cyber-Physical System Projects

CEA-Leti, coordinator of the pan-European consortium EuroCPS, today announced that the 15 partners are continuing their support for SMEs, midcaps and large companies with the second open call for industrial projects, which is open from Oct. 28 to Dec. 2. Innovative cyber-physical system (CPS) projects can be submitted. [More]
Macronix Debuts High Performance Quad SPI NOR Flash for Xilinx UltraScale FPGAs

Macronix Debuts High Performance Quad SPI NOR Flash for Xilinx UltraScale FPGAs

Macronix International Co., Ltd., a leading integrated device manufacturer in the Non-Volatile Memory (NVM) market, today announced a new high performance Quad SPI NOR flash for the Xilinx® 7 Series and UltraScale™ FPGAs. These FPGA’s are geared towards the aerospace and defense, industrial, and public safety applications. The Macronix MX66U51235FME is the industry’s first commercially available extended temperature range product to meet the grueling demands of the Aerospace and Defense (A&D) market. [More]
University of Cologne Acquires Oerlikon Leybold Vacuum Systems for the COPT.ZENTRUM

University of Cologne Acquires Oerlikon Leybold Vacuum Systems for the COPT.ZENTRUM

For the University of Cologne, the COPT.ZENTRUM is a central element of their technology transfer strategy from science to practice. Small and middle-sized companies will benefit from the premises of the center, the technology, and the newest scientific findings in the field of organic electronics. Oerlikon Leybold Vacuum supplies the necessary vacuum technology. [More]
New Silicon-Based Technology Helps Manufacture Smaller, Longer-Lasting Batteries

New Silicon-Based Technology Helps Manufacture Smaller, Longer-Lasting Batteries

Zhongwei Chen, professor in chemical engineering, along with a few graduate students from the University of Waterloo has developed an advanced technology to produce cost-effective silicon-based anode materials, which are capable of significantly enhancing both the performance and the service life of lithium-ion batteries. [More]
New Technique to Make High-Quality Vanadium Dioxide Thin Films on Wafer Scale

New Technique to Make High-Quality Vanadium Dioxide Thin Films on Wafer Scale

The electronics revolution has largely depended upon the tiny transistor, and recently, researchers at the Penn State University (PSU) have formulated a new method to upgrade the transistor by adding vanadium oxide into it. [More]