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imec and ROHM Semiconductor Partner to Develop ULP Radio Technology for Battery-Operated Wireless Devices

imec and ROHM Semiconductor Partner to Develop ULP Radio Technology for Battery-Operated Wireless Devices

Nanoelectronics research centerimec and ROHMSemiconductor Co. Ltd., aworld-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices. [More]
NPL Launches New e-Learning Courses on Measurement Uncertainty

NPL Launches New e-Learning Courses on Measurement Uncertainty

The National Physical Laboratory (NPL) has just launched two new e-Learning courses that provide a comprehensive introduction to measurement uncertainty. The materials have been specifically developed to make this complex topic easily accessible, understandable and applicable to daily practice - maximising efficiency and productivity. [More]
Strategic Insight into How Transparent Conductor Firms Can Generate New Business Revenues

Strategic Insight into How Transparent Conductor Firms Can Generate New Business Revenues

Research and Markets has announced the addition of the "Transparent Conductor Markets" report to their offering. [More]
Compact Microchips Keep Their Cool at 300 °C

Compact Microchips Keep Their Cool at 300 °C

Temperatures often over 200 degrees C occur in geothermal and oil production – conventional microelectronics hit their limits there. Researchers have now fabricated compact microchips that can keep their cool even at 300 degrees C. [More]
Three Indium Experts to Present at SMTA Southeast Asia Technical Conference on Electronics Assembly

Three Indium Experts to Present at SMTA Southeast Asia Technical Conference on Electronics Assembly

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager – Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia. [More]
MACOM Announces License and Epitaxial Wafer Supply Agreement with IQE

MACOM Announces License and Epitaxial Wafer Supply Agreement with IQE

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology. MACOM detailed recent progress in two areas critical to realizing its future vision of enabling the mainstream adoption of GaN as a large-scale RF semiconductor technology across the industry. [More]
Forecast Report on Global Electronic Packaging Market

Forecast Report on Global Electronic Packaging Market

Research and Markets has announced the addition of the "Global Electronic Packaging Market 2014-2018" report to their offering. [More]
Vishay Introduces Dual N-Channel TrenchFET Power MOSFET in Ultra-Compact Thermally Enhanced Package

Vishay Introduces Dual N-Channel TrenchFET Power MOSFET in Ultra-Compact Thermally Enhanced Package

Vishay Intertechnology, Inc. today introduced a new dual n-channel TrenchFET® power MOSFET in the ultra-compact, thermally enhanced PowerPAK® SC-70 package. Designed to save space and increase power efficiency in portable electronics, the Vishay Siliconix SiA936EDJ features the industry's lowest on-resistance for 20 V (12 V VGS and 8 V VGS) devices at 4.5 V and 2.5 V gate drives in the 2 mm by 2 mm footprint area. [More]
Indium Paper on Voiding Behavior of Mixed Solder Alloy Systems Awarded Honorable Mention at IPC APEX Expo

Indium Paper on Voiding Behavior of Mixed Solder Alloy Systems Awarded Honorable Mention at IPC APEX Expo

Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly at the opening ceremony of the IPC APEX Expo on March 25. [More]
IC Design Customers Offered Full Set of SMIC’s ESD Protection Service

IC Design Customers Offered Full Set of SMIC’s ESD Protection Service

Semiconductor Manufacturing International Corporation ("SMIC"), China's largest and most advanced semiconductor foundry, announced today that a full set of Electrostatic Discharge (ESD) protection service, including documents, checklists, PERC Suite, floor plan review, and risk management services, has been offered to IC design customers to enhance the whole chip ESD design and ensure their first silicon success. [More]