Instruments Plasma Technology (OIPT), a leading manufacturer of systems for
etch, deposition and thin film growth, is pleased to announce an order from
University of California Santa Barbara, (UCSB) CA, USA for its FlexAL Atomic
Layer Deposition (ALD) tool.
The FlexAL is a compact Plasma ALD system that allows the combination of both
plasma and thermal ALD in a single, compact tool making it ideal for leading
edge research. "The UCSB Nanofabrication Facility is excited at the addition of
the Oxford Instruments FlexAL ALD system. This system offers great flexibility
for thermal and plasma-based processes with in-situ diagnostic tools to address
the needs of a diverse optical and electrical device research effort within our
facility. We look forward to working with Oxford Instruments." comments Brian
Thibeault, UCSB, Dept. ECE.
Chris Hodson, ALD Product Manager at OIPT said, "Oxford Instruments is
pleased that UCSB selected our most advanced Plasma ALD system for their future
research activities in thin film growth. We are also excited to be part of the
university's Nanofabrication Facility's success linking local nanotechnology
companies and researchers into a chain that stretches across the country. This
is our fourth Plasma ALD system in the NNIN network."