Bond EP37-3FLFAN is a thermally conductive and electrical insulative potting
compound. It is an attractive choice for applications where a dielectric heat
transfer adhesive is required.
This two part epoxy has physical strength properties and a high degree of flexibility
that holds up well to radical temperatures: up to 250°F and in cryogenic
environments down to 4K. The adhesive exhibits an impressive thermal conductivity
of 25 BTU and a volume resistivity of 1 x 1014 ohm cm, a high insulative capacity
for an electrical potting epoxy.
This thermal potting compound is formulated to cure at room temperatures and
forms tough bonds that are resistant to shock, impact, thermal cycling and chemicals.
EP37-3FLFAN is an ideal potting system and encapsulation material due its
low viscosity and flow characteristics. The uniqueness of EP37-3FLFAN lies in
the fact that this thermally conductive adhesive retains a high level of flexibility
while having the desirable physical characteristics inherent in epoxies.