Bond Inc., Hackensack, N.J. has developed a new two part adhesive system
called EP21AN with a thermal conductivity in excess of 22 (BTU•in/ft²•hr•°F).
It is an outstanding electrical insulator with a dielectric strength of >400
volts/mil and a volume resistivity greater than 1013 ohm-cm.
This easy to use adhesive has been formulated with a non-critical 1/1 mix ratio
by weight or volume. It cures readily at ambient temperatures or more quickly
at elevated temperatures.
Master Bond EP21AN features excellent adhesion to a wide range of substrates
including metals, ceramics, glass and many plastics. Bonds exhibit outstanding
dimensional stability and shrinkage upon cure is exceptionally low. Master Bond
EP21AN is available in 1/2 pint, pint, quart, gallon and 5 gallon kits.