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ASM to Host Interconnect Technology Seminar

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ASM International N.V. (NASDAQ: ASMI and Euronext Exchange in Amsterdam: ASM) will host an interconnect technology seminar on Tuesday, June 2, 2009 at the Royton Sapporo Regent Hall in Sapporo, Japan.

The seminar is being held in conjunction with the 12th IEEE International Interconnect Technology Conference (IITC).
At the seminar, Masazumi Matsuura, Senior Engineer of Back-end Thin Film Technology at Renesas Technology Corporation will discuss "Technology Boosters using UV Curing for Advanced SoC Devices".

To conclude the program, ASMI will host a Poster Session addressing Low Temperature PEALD for Spacer Defined double Patterning, ALD for Phase Change Memory, Metal Deposition in Batch Furnace, the Integration of Low-k Materials, and UV Cure for Logic and Memory.

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