New Epoxy for Potting and Encapsulating Applications

Published on October 27, 2009 at 11:11 PM

Master Bond's newly developed EP29LP-1 epoxy is an attractive potting compound for use in large potting and encapsulating applications. Presenting a gamut of significant potting properties, good compound flow, easy set up and convenient handling, it exhibits a remarkably low exotherm, maximum pot life and desired electrical insulative qualities .

The very long working life at ambient temperatures exceeds 6 hours and qualifies this compound for filament winding applications. Its excellent physical strength properties enhance component resistance to thermal shock and it has excellent resistance to chemicals such as fuels, acids, bases, water and salts.

EP29LP-1 is a low viscosity, two part, optically clear epoxy designed to adhere to many substrates, including optical fibers and fibrous reinforcements such as glass, aramid, and graphite. The low viscosity speeds impregnation and facilitates air release. The availability of versatile cure schedules- ambient temperature or accelerated elevated temperature cures, further simplifies manufacturing applications.

The bond strength of EP29LP-1 is greater than 3,500 psi, assuring durable and long lasting performance. It has a peak exotherm as low as 50°C to help avoid excess heat buildup and damage to thermally sensitive components. Extended operating temperature ranges from -100°F to 250°F.

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