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Fast Cure Temporary Adhesive for Electronic Applications

Published on December 29, 2009 at 8:28 AM

Master Bond's UV14-3 is a temporary bonding adhesive that has a fast UV cure ideal for automated, non- permanent adhesive assemblies. Environmentally safe, the temporary adhesive can be easily removed without surface contamination. It cures within seconds upon exposure to UV light at room temperatures and produces high strength bonds to a variety of substrates.

The removable adhesive's high flexibility imparts excellent vibration and shock resistance as well as resistance to thermal cycling and thermal shock. Master UV14-3 can be cured in much greater section thickness (up to 1/8 inch deep) compared to most conventional UV type systems, making it of value for various electronic and opto-electronic potting and encapsulation applications. Disassembly can be easily accomplished upon exposure to most conventional solvents such as acetone, MEK, etc.

Master Bond UV14-3, UV cure adhesive, is durable and tough. The re- workable adhesive has a Shore D hardness of 30 and an elongation of 150%. Featuring a volume resistivity of 1014 ohm-cm, UV14-3 is a superb electrical insulating compound. Having a low viscosity of 800 cps makes it easy to apply. Non-yellowing properties combined with a refractive index of 1.47 qualify it for use in optical applications. It has a service operating temperature range of -60°F to +250°F. Storage stability is 6 months at room temperatures in unopened containers.

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