By Cameron Chai
AIM, a solder assembly material manufacturer for component manufacturing, PC fabrication, electronics assembly and other industries, has reported that the Vice President of Technology, Karl Seelig, will deliver a presentation at the International Conference on Soldering & Reliability (ICSR).
This conference will happen at the Crowne Plaza Toronto Airport Hotel in Canada, from 16 to 18 May, 2012. The presentation will be on “Lead-Free Alloy Development”.
This paper aims to examine various factors related to the alloy families, including non-silver and low silver. These factors are utilization of these replacement alloys in solder paste for fixing a component, and an evaluation of the alloys’ paste medium chemistries and its impact on assemble performance. This paper categorizes these alloys in terms of thermal shock and drop shock risks. HiP mitigation, voiding and wetting are the other significant features that will be presented in the conference.
Several technical papers have been written and presented by Karl. The topics of those papers include no-clean flux technology, lead-free electronics assembly, process optimization and assembly, metallurgical studies, and inspection. He is the IPC Solder Products Value Council’s Chairman and is involved in the expansion of the specifications of the material, under IPC. He has obtained many patents in soldering technology that contains four solder alloys, free from lead.