By Cameron Chai
GLOBALFOUNDRIES disclosed that the company's Fab 1 located in Dresden, Germany has supplied 250,000 semiconductor wafers using 32 nm high-k metal gate (HKMG) technology. This is a major landmark representing the company's competitive edge over other foundries using HKMG technology and its ability to ramp advanced technologies to mass production.
On a unit basis, total shipments of 32 nm wafers are more than two-fold than that of 45 nm wafer production during the first five quarters, which represents a significant growth of 32 nm ramp over 45 nm ramp, regardless of the addition of several new and intricate components in both process and design technologies.
Recently, one more wafer production facility was constructed at by GLOBALFOUNDRIES at Fab 1 in Dresden to increase the production capacity of wafers at £ 45 nm. When the new facility is completely ramped, the overall production capacity of Fab 1 can be increased to 80,000 wafers per month. The capacity expansion also increased the site's cleanroom space by adding over 110,000 sq. ft, making the Fab 1 campus as the largest wafer fab for advanced technology in the European region. At present, over 50% of the production at Fab 1 is based on HKMG technology. Besides the 32 nm technology, GLOBALFOUNDRIES' 28 nm products are tested and set for design-in.
Rory Read, President and Chief Executive Officer at AMD, commented that the shipment of 250,000 32 nm HKMG wafers is an evidence of the close partnership between the company and GLOBALFOUNDRIES. This successful 32 nm HKMG ramp helps the company and GLOBALFOUNDRIES to advance towards 28 nm technology.
The Chief Executive Officer at GLOBALFOUNDRIES, Ajit Manocha stated that AMD and other customers will take advantage from the company' s mass ramp of advanced APUs at 32 nm because its 28 nm technology utilizes similar HKMG implementation as 32 nm.