By Cameron Chai
AIM, a producer of solder assembly materials for use in component manufacturing, PC fabrication, electronics assembly, and other industries, has announced that the company’s NC258 lead-free & tin-lead solder paste will be showcased at the SMTA Toronto Expo & Tech Forum. This forum will be held at the Crowne Plaza Toronto Airport Hotel in Canada, on May 16, 2012.
The company has specifically developed this new NC258 solder paste in order to provide long pause-to-print potentials, when the fine print definitions are improved. Faults like head-in-pillow and voiding are minimized through this NC258 solder paste. This solder paste has higher potential in wetting process, which results in shiny, smooth and bright solder joints. It provides residues from very low post-process and are translucent even at higher temperatures needed for lead-free alloys that are manufactured nowadays.
NC275LR and NC265LR are the two prominent halide-free and no-clean spray fluxes and will be displayed at this show. NC265LR is formulated based on alcohol. NC275LR is free from VOC. These two fluxes provide a very broad process window that enables good wetting. They also provide low post-process residues and will minimize the necessities of preventative maintenance for spray fluxing applications. These fluxes can be used in a variety of tin-lead and lead-free solder alloys.
AIM will exhibit its lead-free and tin-lead alloys at the show, wherein SN100C will also be included. Japan-based Nihon Superior has developed this SN100C, which is a lead-free solder alloy.