By Nick Gilbert
THERCOBOND, a new line of highly thermally-conductive bonding and printed materials, has been launched by Applied Nanotech, a nanotechnology company. The materials are mainly designed for applications in photonics and power electronics.
The THERCOBOND line of bonding materials offers printability, wettability, dielectric and insulating properties, thermal expansion, thermal diffusivity and thermal conductivity.
The materials can be easily applied on a wide range of substrates by using inkjet, drawdown, conventional screen printing and other printing methods. This results in the formation of thermally conductive dielectric layers for electronic packaging applications. DTC-C, a ceramic-based thermally conductive material, and DTC-P, a polymer-based material, are two products in the THERCOBOND series.
DTC-P is a series of electrically insulating materials made of dielectric polymers, which increases thermal conductivity with superior wettability and adhesion to graphitic substrates, semiconductors and metals. It is a one-part bonding material and works at a temperature ranging up to 300°C. Another product in the THERCOBOND family, DTC-C is also a one-part bonding material that is made of dielectric ceramics. This electrically insulating material is more heat resistive and has a working temperature up to 400°C.
Doug Baker, Applied Nanotech’s CEO, stated that there is a large potential market for THERCOBOND line of materials as the global market for thermally-conductive materials is estimated to be more than $600 million by 2016. The THERCOBOND materials now join the company’s growing range of nanotechnology-based superior performance products, which includes Carb Althermal management material and CNT stix ultra-strong adhesive.