By Nick Gilbert
MARTIN has announced that its solder bumping or mini-oven reball unit will be exhibited at the SMTA Upper Midwest Expo & Tech Forum, which will be held on 7 June, 2012. This forum will take place at the Hilton Minneapolis/Bloomington Hotel located in Minnesota.
The MINIOVEN 04 is perfect for use in re-balling CSPs and BGAs, and pre-bumping QFNs. A reflow environment is offered by this mini-oven in a stand-alone unit. The efficient circulation of hot gas ensures controlled reflow and the component’s optimal heating. Programmable modes are provided by the unit, which can accommodate up to 99 profiles. The unit has the potential to fine-tune parameters and edit individual profiles. Gases like argon, formic and nitrogen can be processed with the help of a gas connection.
The company has specifically developed BGA reballing, dispensing technologies, hand soldering, and affordable rework for almost 30 years. It is a FINETECH company, whose USA sales and service office is situated in Manchester, NH. The manufacturing unit of the company is located in Wesseling, Germany.