By Cameron Chai
Engineered Conductive Materials, a major provider of conductive interconnect materials for use in photovoltaic applications, has announced the launch of two advanced conductive grid inks namely, CI-1031-7 and CI-1031-8.
These next-generation material formulations are designed for thin-film solar module applications. They have been specifically formulated to provide low contact resistance and superior conductivity on transparent conductive oxides that are utilized in solar applications.
The CI-1031-series conductive grid inks comprise high solids contents and demonstrate improved rheologies, thus enabling screen printing of fine lines with high aspect ratio to decrease shadowing and optimize the print thickness. They are thermosetting inks with low shrinkage and low stress and demonstrate low polymeric creep and remarkable moisture resistance. They have very low line resistivity at 8 mW/sq/mil (1 mil emulsion; 230 mesh).
CI-1031-7and CI-1031-8 are the new members of Engineered Conductive Materials' extensive portfolio of conductive grid inks for use in photovoltaic applications, conductive adhesives for use in back contact crystalline silicon, via fill and thin-film applications, and conductive stringer attach adhesives.
Engineered Materials Systems is the parent company of Engineered Conductive Materials. The latter concentrates on electronic circuit fabrication technology that complements the circuit assembly product portfolio of Engineered Materials Systems.