By Nick Gilbert
Engineered Conductive Materials, a provider of conductive interconnect materials for use in photovoltaic applications, will display the new low temperature curing conductive adhesive called the DB-1541-LTC at the forthcoming Intersolar North America conference and exhibition.
The Intersolar North America conference and exhibition will be held between July 10 and 12, 2012, at the Moscone Center located in San Francisco, California. The DB-1541-LTC is a suitable material formulation for application in organic photovoltaics and organic light emitting diodes. This low temperature curing conductive adhesive has been formulated to demonstrate superior stability and conductivity on different substrates when subjected to curing at ³ 100°C.
The DB-1541-LTC adhesive is curable at temperatures as low as 100°C. However, this novel formulation demonstrates a dispensing work life more than 48 h (calculated as a 25% rise in viscosity). It maintains optimal rheology for dispensing and superior conductivity stability and damp heat resistance on silver-plated, tin-silver and tin ribbons.
The DB-1541-LTC demonstrates flexibility like rubber, making it suitable for flexible applications that require high peel strength to endure the stresses developed in reel-to-reel production processes. This advanced material can also be cured rapidly at elevated temperatures (one minute at 180°C).
Engineered Materials Systems is the parent company of Engineered Conductive Materials. The latter concentrates on electronic circuit fabrication technology that complements the circuit assembly product portfolio of Engineered Materials Systems.