By Nick Gilbert
Bergquist, a designer and manufacturer of high performance thermal management materials that are utilized to dissipate heat and keep electronic components cool, has launched Liqui-Form 2000 shear-thinning liquid formable thermal interface material.
This latest high thermal conductivity material is part of the company’s new Liqui-Form product series. The unique formulation of Liqui-Form 2000 ensures reliable long-term performance, low applied stress and excellent thermal performance.
Liqui-Form 2000 product is thixotropic and requires no refrigeration, mixing or curing. It possesses a natural tack, which ensures that it is formed around the parts and remains in position during the application. When compared to the usage of gap filling materials in the form of sheets, the liquid method provides infinite thickness options and prevents the need for particular die-cut shapes or pad thicknesses for individual applications. Applying exact amounts of liquid material directly to the targeted surface leads to effective usage of material with minimum wastage. Liqui-Form 2000 is offered in pail and cartridge forms and it is ideal for both manual and automated dispensing.
In addition to offering Liqui-Form formable materials, Bergquist supplies several other renowned brands across the world, including Thermal Clad insulated metal substrates, Bond-Ply thermally conductive adhesive tapes, Hi-Flow phase change grease replacement materials and Sil-Pad thermally conductive interface materials.