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Engineered Conductive Materials Unveils Fast Curing Conductive Adhesive for CIGS Solar Modules

Published on August 10, 2012 at 8:05 AM

By Nick Gilbert

Engineered Conductive Materials, a provider of conductive interconnect materials for use in photovoltaic applications, has announced the introduction of CA-100, a new fast curing conductive adhesive for stringing and bussing advanced CIGS solar modules.

This new material formulation from Engineered Conductive Materials is engineered for superior stability and conductivity on substrates such as molybdenum utilized in thin-film production. CA-100 is formulated for damp heat stability and thermal cycling on substrates such as molybdenum utilized in the CIGS production process.

The high Tg of CA-100 is ideal in the production of semi-rigid glass backed modules. However, it is not formulated for flexible modules that use reel-to-reel production process. It is possible to partly cure the material for 60-90 s, delivering adequate ‘green strength’ to handle induced stresses from the production process until the complete curing of the adhesive during the encapsulant lamination process.

This new fast curing conductive adhesive demonstrates higher conductivity stability, superior damp heat resistance, and better rheology for dispensing on tin, molybdenum, tin-silver and silver-plated ribbons. It is the new member of Engineered Conductive Material’s portfolio of conductive adhesives and conductive stringer attach adhesives for thin-film, back contact crystalline silicon and via fill applications, and conductive grid inks for photovoltaic applications.

Engineered Materials Systems’ product line is Engineered Conductive Materials. The latter specializes in electronic circuit fabrication that adds value to the circuit assembly product line of Engineered Materials Systems.

Source: http://www.conductives.com/

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