By G.P. Thomas
EV Group, a company providing lithography and wafer bonding tools for semiconductor, nanotechnology and MEMS industry, has launched the redesigned, automated, high volume coater, the EVG150 resist processing platform.
The next-generation coating platform is a universal processing system that incorporates spin coating module with the proprietary spray coating technology from EV Group.
The EVG150 was developed by leveraging EV Group’s 15 years of expertise in spray coating and resist coating technologies. The resist processing line of EV Group is suitable for wafers with diameters up to 300 mm. The EVG 150 platform which is part of this product line is suitable for wafers measuring 50 to 200 mm in diameter. The new platform facilitates the combination of chill plates, two stacks of hot plates and vapor prime modules with a maximum of four modules for wet process. The EVG150 is capable of performing spray coating, spin coating and lift off. The enhanced serviceability and reduced down time is the result of its modular arrangement. The Computer Integrated Manufacturing (CIM) Framework of EV Group is employed as the software platform to optimize the throughput of the EVG150 platform.
The OmniSpray technology of EV Group facilitates high topography surfaces to be coated with uniformity through its ultrasonic nozzle. This technology has been implemented at over 100 customer sites of EV Group. The EVG150 platform incorporates the OmniSpray module too. Another module option available with the EVG150 is the patented NanoSpray technology that has the capability to coat surfaces that are at vertical side angles.