Written by AZoM
Dow Corning, a global leader in silicones, silicon-based technology and innovation, today announced that it will have a major presence at IEEE Electronic Components and Technology Conference 2013 (ECTC), where it will present a paper on an advanced new temporary bonding breakthrough and introduce two new high-end thermally conductive compounds for the semiconductor industry.
The company will also feature its other industry-leading silicone materials at its booth (#309). ECTC will be held at the Cosmopolitan Las Vegas Hotel & Casino in Las Vegas, Nev. from May 28 – 31.
Ranjith John, materials development & integration engineer at Dow Corning, will present the paper titled Low Cost, Room Temperature Debondable Spin on Temporary Bonding Solution: A Key Enabler for 2.5D/3D IC Packaging.
Co-authored with SUSS MicroTec, the paper covers the co-development of a new bi-layer technology for temporary bonding of very thin wafers, signaling new potential for enabling high-volume manufacturing of 2.5D/3D IC stacking. Notably, the development eliminates the need for specialized equipment for wafer pretreatment before bonding or wafer post-treatment for debonding.
John will present the paper at 10:50 a.m. on Wednesday, May 29 in the Mont-Royal 2 room as part of ECTC’s 3D Materials & Processing Session.
“Our collaboration with SUSS MicroTec enabled us to introduce a unique and complete solution that leverages both the thermal stability and stress relief of our high-end silicones as well as SUSS’s equipment expertise for 3D through-silicon via, wafer-level processing and microelectromechanical systems markets,” said Andrew Ho, Global Business Director Advanced Semiconductor Materials at Dow Corning.
“This advancement embodies what is possible through collaborative innovation. Moreover, it comes at a critical time in the semiconductor industry when 3D IC integration is increasingly viewed as a way to reduce form factor while improving the electrical and thermal performance of microelectronics to meet the seamless needs of next-generation communication devices.”
In addition to presenting the paper, Dow Corning will host a booth at ECTC 2013 that further underscores the company’s leadership position as an innovator of advanced silicone materials for the semiconductor industry. Specifically, the company will launch two high-performance thermally conductive compounds.
The products’ optimized rheology eliminates the need for common solvent diluents in formulations that can evaporate over time, resulting in less environmental impact vs. many competitive materials, and offering improved stability against hardening or dry-out in end use applications.
“Dow Corning is looking forward to taking part in ECTC in a major way to showcase the wide and expanding range of high-performance materials and capabilities we provide to our semiconductor customers worldwide,” said Ho. “As a committed collaboration and innovation partner, we work hand-in-glove with customers to understand their applications and to enable the development of next-generation solutions by building on some of the most advanced silicone technologies on the market today.”
Top-level Dow Corning management and technology experts will be on hand at ECTC for media interviews to discuss the company’s new developments and its range of technology options for the global semiconductor industry.
About Dow Corning
Dow Corning provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® brands.
Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States. Dow Corning’s global operations adhere to the American Chemistry Council’s Responsible Care® initiative, a stringent set of standards designed to advance the safe and secure management of chemical products and processes.
® Dow Corning is a registered trademark of Dow Corning Corporation.
® XIAMETER is a registered trademark of Dow Corning Corporation.
® Responsible Care is a registered service mark of the American Chemistry Council, Inc.