Feb 10 2014
Entegris, Inc., a leader in contamination control and materials handling technologies for highly advanced manufacturing, released a new wafer shipping solution for the safe and reliable transport of 200 mm wafers used in the manufacturing of semiconductors, LEDs and MEMS.
The new shippers allow silicon suppliers and device manufacturers to ship and store the latest generation of lens/bumped wafers, which are thinner and more sensitive to damage and contamination.
"The semiconductor industry is shifting to thin and ultra-thin wafers in order to make smaller, higher performing and lower cost devices," said Bill Shaner, vice president and general manager of Entegris' Microenviroments Division. "This new shipping product is the latest in a long line of time-tested solutions developed by Entegris to help improve yields and increase productivity for device manufacturers as they advance their manufacturing processes."
New generations of thinner 200 mm wafers are being used to produce a broad range of advanced chip designs for SOC, MEMS, LED and power semiconductors. The unique "contactless" design of the new Entegris shipper minimizes contact with the wafer surface, and replaces the need for separators inserted between the wafers during shipping, which can damage or contaminate sensitive wafers. A 25-wafer capacity designed for automation also enables improved productivity.
Source: http://www.entegris.com