Kyocera announced today that its North American sales organization for epoxy molding compounds, die attach pastes, and all other semiconductor encapsulation products was transferred from Kyocera Industrial Ceramics Corporation to Kyocera America, Inc., based in San Diego, California, effective April 1, 2014.
Kyocera’s current organic chemical materials business originated with the founding of the Chemical Materials Division of Tokyo Shibaura Electric Co. Ltd. (now Toshiba Corporation) in 1935. In 2002, the unit joined the Kyocera Group as Kyocera Chemical Corporation, headquartered in Japan.
Today, as a pioneering manufacturer of epoxy encapsulation materials for the semiconductor industry, Kyocera has earned a reputation for reliability with semiconductor manufacturers worldwide. Kyocera also provides conductive and non-conductive pastes for semiconductors and electronic components used in some of the most advanced devices. Many of Kyocera’s advanced thermally conductive materials are currently used, or qualified to be used, with high-power devices targeted to reduce carbon emissions.
Major Kyocera chemical products for the semiconductor industry include:
- Epoxy Encapsulation Materials for IC Packages
(transfer molding, compression molding, and Cu-wire bonding applications)
- Die Attach Paste
(silver epoxy and silver sinter materials)
- Anisotropic Conductive Pastes
- Photosensitive Organic Passivation Materials
- Thermo-Melting Sealing/Bonding Sheets
- Micro Device Caps
For additional information, please contact:
Kyocera America, Inc.
8611 Balboa Ave.
San Diego, CA 92118
Phone: (800) 468-2957
Email: [email protected]
Source: http://global.kyocera.com/