Jun 28 2014
Reportlinker.com announces that a new market research report is available in its catalogue: Electronic Adhesives Market by Type (Electrically Conductive, Thermally Conductive, UV Curing & others), Form (Liquid, Solid & Paste), Application (Semiconductor & IC and Printed Circuit Boards (PCB)), and Geography - Regional Trends & Forecast to 2019.
The electronic adhesives market was estimated around $3.0 billion in 2013, with the highest share of more than 60% held by Asia-Pacific and RoW together. The global market is projected to grow at a CAGR of 10.1% from 2014 to 2019 to reach $5.5 billion by 2019. The highest investment is projected to be in the Asia-Pacific region due to the growing application markets, especially in China. The electronic adhesives market in the RoW region is estimated to witness the second highest growth at 6.80% from 2014 to 2019.
H.B. Fuller (U.S.) and Henkel AG & Company (Germany) are the important active players in the electronic adhesives market. These companies showed the highest strategy adoptions amongst other players in the global electronic adhesives market, accounting for over 60.0% of the total market activities from 2010 to 2014.
From 2010 to 2014, mergers & acquisitions were observed as the most important growth strategy adopted by the electronic adhesive companies, accounting for a share of 40.0%. The other companies — Alent (U.K.), Hitachi Chemicals (Japan), Dow Corning (U.S.), and Dai Nippon Printing Co. Ltd. (Japan) contributed the other 40% of the market activities in the electronic adhesives market during the period of study.
The key companies offering electronic adhesives are mainly involved in acquisitions. The companies rigorously adopt the acquisition strategy to strengthen their position in the electronic adhesives market. The acquired player is sometimes a small player in a new market or a player with high technical expertise. The large players of the market actively participated in expanding their global reach, while the small companies concentrated more on new product developments during 2010 to 2014.
Source: http://www.reportlinker.com