SENTECH offers leading edge plasma process technology equipment for etching and deposition, as well as thin film measurement instrumentation.
We proudly presented our new combinatorial system “SIPAR” for PEALD & IC PECVD at the ThGOT conference (Thuringian surface days). At the ThGOT, SENTECH presented their innovative system “SIPAR”, which combines PECVD and PEALD technique in one reactor for depositing moisture barriers.
The SIPAR complements the wide ranging SENTECH product portfolio with an innovative alternative to cluster systems. In contrast to conventional cluster systems this smart IC PECVD and PEALD combination offers a cost effective solution for the needs of industry and R&D.
Combining the advantages of SENTECH PEALD, which features excellent conformity and homogeneity, and IC PECVD for high deposition rates at lowest temperatures, the deposition of hybrid multilayer moisture barriers in one reactor is facilitated.
Due to the fact that no handling is necessary, processing time will be saved and contamination will be prevented. The ThGOT took place from 2-4th of September in Leipzig, Germany. It was the 10th anniversary of this popular conference and many visitors from industry and science attended the various presentations and poster sessions.
SENTECH participated on the event with a booth as well as with introducing the newly developed combinatorial system for PEALD and IC PECVD “SIPAR” for depositing moisture barriers. “The interest in ALD has grown enormously in the last years, this can be seen from the increasing number of presentations on the topic at ThGOT” Dr Gargouri, one of SENTECH's plasma specialists resumes. If you are interested in more details of our new IC PECVD & PEALD system SIPAR, please contact us here.