DuPont Electronic Technologies has joined IMEC, an independent electronics research center, as an Industrial Affiliate in 45nm and 32 nm technology development programs on cleaning, contamination control and advanced interconnects. During the initial two-year program, EKC Technology, part of DuPont Electronic Technologies, will provide resident technical staff and will be fully engaged with IMEC in developing new post-CMP cleaning solutions for their Cu/low-k scaling program. In addition, EKC will utilize IMEC technology for testing of newly developed post-etch residue removers.
"The need for collaboration in new materials development is well-recognized by the semiconductor industry, and IMEC has consistently demonstrated a proven model for success in this area. We look forward to working closely with the other industrial affiliates to advance and commercialize enabling technologies for advanced interconnects," said Douglas Holmes, director of marketing, EKC Technology, DuPont Electronic Technologies.
"The collaboration with DuPont Electronic Technologies will enable us to evaluate the performance of various EKC post-chemical mechanical planarization (CMP) cleaning solutions. It also will allow us to obtain generic knowledge that can explain phenomena observed during post-CMP cleaning," said Serge Vanhaelemeersch, department director of Advanced Materials & Process Steps at IMEC.