The VCSEL industry is growing at an increasing rate due to new demands from optical interconnect, LIDAR technology or face recognition. VCSEL manufacturing is rapidly scaling up globally with the VCSEL fabrication process achieving ever higher yield and quality. Applications like 3D sensing focus on maximum power conversion with arrays of VCSELs for higher combined output power. Within each array, the threshold current and differential quantum efficiency must be uniform for each laser. This means that control of epitaxy is required. In addition to this, very good control of the shape of the mesa is also needed. Challenges on uniformity, line width and aspect ratio emerge as the need for denser array increases.
Oxford Instruments Plasma Technology has developed advanced plasma processing solutions to deliver the device performance and yield demanded by the VCSEL market using their strong process expertise and extensive device understanding. Oxford instruments focus on how to best control the geometry of the mesa for wafer size up to 150 mm for this white paper. Oxford instruments review the key requirements for achieving either a tapered or vertical profile with precise control of the depth of the mesa.
Download the Full Article
This information has been sourced, reviewed and adapted from materials provided by Oxford Instruments Plasma Technology.
For more information on this source, please visit Oxford Instruments Plasma Technology.