Semiconductor Heat Treatments

The production of semiconductor systems and materials is complex, involving multiple different steps and chemical processes such as lithography, oxidation and diffusion.

Lithography involves exposing the substrate of the semiconductor to dopant materials via a controlled process, which optimizes the semiconductors electronic behavior towards a specific application. Lithography is the final step in the entire semiconductor manufacturing process; meaning contamination must be avoided at all costs.

This means the thermal processing chambers must be free from contamination and the ceramic heaters should be at their best performance.

During lithography, doping of the semiconductor tends to occur via diffusive methods involving vaporized dopants such as CVD (chemical vapor deposition) or ALD (atomic layer deposition).

Thermal processing at a high temperature is then used to promote permeation of the semiconductors thin film structure, prior to strengthening of the devices overall structure.

This high thermal processing temperature can be produced using a ceramic heating unit, as this is far less contaminating than using a combustion method; meaning the high level of purity required for semiconductor applications is upheld.

FibercraftTM Ceramic Heating Elements

The FibercraftTM range uses a flat metallic wire wound around a low-mass, inert ceramic to heat furnaces; this design results in maximum heat dispersion by tripling the systems radiative surface. The overall effect is increased heat transfer with lower operating needs.

The FibercraftTM range includes the FC-200 and FC-200L which can both operate within the temperature range of 200 – 1200 °C (392 – 2192 °F). Both systems can be used for semiconductor oxidation, diffusion treatment and LPCVD over a long service life.

DuracraftTM Ceramic Heating Elements

DuracraftTM are heating elements designed for the ALD or CVD, and subsequent processing, of semiconductor substrates. The systems provide excellent temperature uniformity, with heating wiring wound around the heating element for improved radiation, and improved thermal shock resistance.

The DuracraftTM range includes the DCHT-500, the DC-1300, and the DC-1300Plus. All of these heating elements can operate between 400 – 1300 °C (400 – 2372 °F), with high temperature stability, and can be used for oxidative processes and advanced diffusive methods such as horizontal and vertical low-pressure CVD (LPCVD).

Ceramic Heating Elements from Thermcraft

Thermcraft has been a key supplier of heating systems to the semiconductor industry for many years. Their components can be used for established semiconductor treatments or for novel research into next-generation processes and technologies.

This information has been sourced, reviewed and adapted from materials provided by Thermcraft Inc.

For more information on this source, please visit Thermcraft Inc.


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