The product explored in this article is a door module with a serious warpage problem (Figure 1). The deformation caused issues during the assembling process. To overcome challenges like this, KOPLA used Moldex3D to identify changes in a variety of materials, from steel to plastic, in the hope of achieving a lightweight target.
Researchers used the Moldex3D FEA Interface to perform an in-depth structural analysis (ANSYS). Consequently, KOPLA managed to effectively identify an optimized gate location design and determine suitable materials that minimize warpage and successfully overcome assembly challenges.
Figure 1. The door module in this example has a serious warpage problem.
- Serious warpage problems
- Achieving the lightweight target
- Poor assembly quality
KOPLA applied the Moldex3D eDesign and FEA Interface module to find out the material properties and overcome the warpage problem.
- Successfully improved warpage
- Effective identification of material properties
- Seamless workflow, from injection molding to structural analysis
- Reduced cost of mold trials
This case study involved examining the design of a car’s side door. As a number of holes on the part are designed for assembly with other parts, the positions of the holes are highly significant. The main concern in this particular case is that warpage is minimized and assembly quality is guaranteed.
To find a solution, KOPLA employed Moldex3D. For KOPLA, the first challenge was to find a proper gate position to achieve better filling patterns and reduce the potential warpage ratio. KOPLA made repeated changes to the gate position settings until an optimal setting was found, which allowed researchers to determine the gate type based on the warpage analysis results (Figure 2).
Figure 2. KOPLA repeatedly changed the gate position settings and simulated the deformation results.
Once KOPLA had determined the ideal gate location design, it was able to further output the warpage results (including fiber orientation and certain elemental properties) using the Moldex3D FEA Interface to ANSYS. This allowed researchers to analyze the product strength and stability during assembly with other parts, and attain an in-depth structural analysis.
KOPLA observed that the part was warped towards the opposite side of the assembling plain, and thus chose to use reversed mold warpage to compensate for the deflection. Moreover, the planar displacement of the bolt holes was considered to correct the accuracy of the hole location (Figure 3 and Figure 4). KOPLA successfully optimized the deformation and improved the structural design by varying the boundary condition settings and investigating the bolting displacement of the assembled part.
Figure 3. The holes in the deformed model were consistent with the assumption.
Figure 4. The structural analysis of the part when being assembled with other parts.
KOPLA was able to successfully optimize the product deformation and improve the structural design using the Moldex3D and ANSYS structural analysis tools. Researchers were also able to identify consistent patterns between the analysis results and the real product. This allowed them to better understand the material properties of the product and optimize future product design decisions.
This information has been sourced, reviewed and adapted from materials provided by Moldex3D.
For more information on this source, please visit Moldex3D.