APD - Nanoparticle Deposition System from ULVAC Technologies

Arc Plasma Deposition (APD) is a unique form of physical vapor deposition that is used for the deposition of uniformly sized nanoparticles (2 nm to 9 nm dia) of platinum and other conductive metals onto micron-size powder substrates. This system is rendered useful for battery, fuel cell and catalyst research.

This capability renders this system useful for battery, fuel cell and catalyst research. The APD system enables the deposition of alloys, magnetic materials, dense metal films and DLC all without using any process gas. It is possible to produce highly smooth and dense multilayer thin films at rates of ∼0.01 to 0.3 nm/sec. Film uniformity is +/-10% over a 50 mm diameter coated area. This equipment can be scaled up to meet the needs of large batch production requirements.


The applications of the APD nanoparticle deposition systems are:

  • The APD-S is used for metallic thin films (magnetic, plasmons, overcoats)
  • The APD-H is used for abrasion resistant coating of machine parts using DLC and lens mold coatings using ultrafine crystal diamond
  • The APD-P is used for fuel cell catalysts, exhaust catalysts, photocatalysts, VOC cracking catalysts, carbon nanotube catalysts and plasmons using nanoparticles.
  • The APDT-1S is used for substrate deposition, metallic thin films and DLC carbon nanotube catalysts

Product Features

The features of the APD deposition systems are:

  • The APD-S/APDT-1S is capable of simple film thickness control by the number of pulses, from an Å-equivalent film thickness to µm-order film thickness control and can obtain dense films with high flatness and adhesiveness by deposition with high energy density from the maximum 400V charging voltage.
  • The APD-H is capable of directly depositing ultra nano crystal diamond (UNCD) with the same hardness as single crystal diamond and features superior thermal conductivity and heat resistance (800°C)
  • APD-P can support nanoparticles having a particle diameter around 1 nm to 30 nm effective for controlling cohesion and sintering even in a high temperature environment
  • Catalytic activity is more than conventional wet process catalysts, oxidation and reduction reactions occur at low temperatures

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