TEM Liftout Grids - Omniprobe Grids

Agar Scientific's omniprobe lift-out grids are designed specifically to accept TEM lamellae milled by FIB or SEM/FIB systems. The grids are 25 - 30µm thick, with posts engineered such that consistent attachment of lamellae is enabled while providing an un-obscured view of each section. All grids are 3mm diameter.

Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling. Beryllium ensures that X-ray peaks from the grid do not interfere with EDS analysis.

Some of the grid types available from Agar Scientific include:

  • 3 post lift-out grids designed for in situ lift-out - These grids include multiple indexed mounting locations, with both vertical bar and V-shaped attachment surfaces and are available in copper or molybdenum.
  • 4 post lift-out grids designed for in situ lift-out - These grids include multiple indexed mounting locations, two with vertical bar attachment surfaces and two with V-shaped alignment surfaces. The sides have a lower profile to allow easy access to the outermost posts and are available in copper or molybdenum
  • 5 post copper lift-out grids are suitable for in situ lift-out - These grids include multiple indexed mounting locations, all with vertical bar attachment surfaces and they incorporate lower profile sides for easier access to the outermost posts.

Other Equipment by this Supplier