Plasma Etching and Deposition Cluster for the Rapid Processing of Silicon Wafers

SENTECH Cluster Configuration tools consist of plasma etching and/or deposition modules, cassette station or vacuum loadlock, and transfer chamber.

The transfer chambers with the handling robot are designed with three to six ports. A maximum of two cassette stations can be employed to enhance the throughput. The transfer chambers have the capacity to be fitted with various options.

SENTECH Cluster Configuration tools can be used for R&D and are operated by a single graphical user interface - the SENTECH control software. This effective control software is offered for industrial high throughput cluster tools.

Key Features

  • High Throughput
    • Deposition modules and plasma etching can be integrated together with up to two cassette stations to enable high throughput processing of up to 200 mm wafers
    Research and Development
    • The transfer chambers with three to six ports are available for clustering ICP plasma etchers, atomic layer deposition systems, RIE etchers, ICPECVD and PECVD deposition tools in order to comply with the prerequisites of R & D. Samples can be loaded through a vacuum cassette station and/or vacuum loadlock.

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