ZEISS Xradia 520 Versa 3D X-ray Microscope

ZEISS Xradia 520 Versa 3D X-ray microscope opens up new degrees of flexibility for scientific discovery. Xradia 520 Versa builds on industry-best resolution and contrast, and expands the boundaries of non-destructive imaging for breakthrough flexibility and discernment critical for research.

Innovative contrast and acquisition techniques allow users to seek and find what they have never seen before, to go beyond exploration and achieve discovery.

Xradia 520 Versa achieves minimum achievable voxel of 70 nm and spatial resolution of 0.7 µm.

Highlights

The Most Comprehensive Submicron X-ray Imaging Solution Providing Unparalleled Flexibility

The ZEISS Xradia Versa series of X-ray microscopes offers well-known advantages such as best contrast, highest resolution, non-destructive submicron X-ray imaging and RaaD (resolution at a distance). In addition to these advantages, ZEISS Xradia 520 Versa improves lab-based X-ray imaging with advanced innovations and techniques:

Dual Scan Contrast Visualizer (DSCoVer)

Flexible side-by-side tuning of two distinct tomographies at varied sample conditions or imaging conditions is provided by DSCoVer. This enables compositional probing for features normally indistinguishable in a single scan, enabling users to effortlessly and seamlessly collect the data required for dual energy analysis.

Imaging a sample in two different states, or at two different X-ray spectra, aligning the resulting data and then combining them assures that users will obtain optimum contrast for the material of interest and they will also be allowed to establish repeatable research parameters.

DSCoVer takes advantage of how X-rays interact with matter based on effective atomic number and density. This provides users with a unique capability for distinguishing, for example, mineralogical differences within rocks as well as among difficult-to-discern materials such as aluminum and silicon.

High-Aspect Ratio Tomography (HART)

Higher throughput imaging for flat samples, such as those found with semiconductor packages and boards, can be obtained with the innovative HART mode on Xradia 520 Versa. HART enables spacing of variable projections that allow collection of increased projections along the thin side of a flat sample and fewer projections along the broad side. These closely-spaced long views versus less densely-spaced short views provide a significant amount of 3D data.

It is also possible to tune HART to emphasize better image quality or higher throughput, potentially accelerating image acquisition speed by 2X.

Automated Filter Changer (AFC)

It is now even easier to image samples that are challenging. Source filters used to tune the X-ray energy spectrum are a vital complement to DSCoVer and in situ applications. A standard range of 12 filters is housed by the AFC along with space for a dozen extra custom filters for new applications.

Filter selection is programmed and recorded easily within imaging recipes so that filters may be changed without disrupting the work flow.

Wide Field Mode and Vertical Stitching

Wide Field Mode provides either an extended lateral field of view for imaging large sample types or higher resolution using the standard field of view, both in a single tomography. For larger samples, the lateral field of view is almost twice as wide as the standard mode providing 3D volume more than three times larger. WFM uses standard field of view to provide nearly twice the number of voxels.

It is possible to image large samples that are both taller and wider than the standard field of view by combining WFM with the Vertical Stitching feature available.

Optional Diffraction Contrast Tomography (LabDCT)

The optional ZEISS LabDCT™ advanced imaging module, built on the industry-best resolution and contrast of ZEISS Xradia Versa X-ray microscopes (XRM), provides direct visualization of 3D crystallographic grain orientation. This powerful combination of diffraction capability with unique reconstruction software for the Xradia 520 Versa meets the increasing demand for metallurgists and materials scientists to obtain such information to accompany data sets.

For the very first time, LabDCT brings non-destructive diffraction contrast tomography (DCT) directly to the laboratory.

Optional Flat Panel Extension (FPX)

Unmatched versatility in a single X-ray system is obtained through ZEISS FPX™ flat panel extension. It is possible to image significantly larger samples (beyond 5” diameter) and greater volumes (10X increase) with high throughput (better by 2 - 5X).

Results can be obtained faster by performing rapid macroscopic scouting scans and then zooming in to regions of interest at high resolution. With FPX, multiscale imaging, characterization, and modeling workflows can be simplified and expanded all on a single platform.

Optional Autoloader

The instrument’s utilization can be maximized by minimizing user intervention with the optional ZEISS Autoloader, available for all instruments in the ZEISS Xradia Versa series of 3D X-ray microscopes. Enabling multiple jobs to run, the frequency of user interaction can be reduces and productivity increased.

Load up to 14 samples, queue, and allow to run throughout day, or off-shift. The software provides the flexibility for re-ordering, canceling and stopping the queue to insert a high priority sample at any time. Regular updates on queue progress are provided by an e-mail notification feature in the ZEISS Scout-and-Scan user interface. Autoloader also enables a workflow solution for high volume repetitive scanning of similar samples.

Optional In Situ Interface Kit

X-ray imaging is ideal for imaging materials under changing environments with controlled conditions including over time (4D) in order to non-destructively characterize and quantify the evolution of 3D microstructures. The Xradia Versa, together with its unique architecture, has emerged as the industry's premier solution supporting the use of a variety of in situ rigs, ranging from high pressure flow cells to tension, compression and thermal stages.

Stable and robust management of often complex in situ electrical and plumbing facilities is delivered by the optional In Situ Interface Kit, which also ensures the performance of Xradia is maintained, along with recipe-based software capability that simplifies operation from within the Xradia Versa user interface. The In Situ Interface Kit is available on all Xradia Versa systems.

Benefits

The Unique Xradia 520 Versa Architecture Delivers Unsurpassed Flexibility

Unparalleled Resolution in Non-Destructive 3D X-ray Imaging

  • Non-destructive interior tomography uniquely enabled by Scout-and-Zoom, now for samples 10x greater in volume with 2 - 5x greater throughput with the optional Versa FPX flat panel extension
  • Two-stage magnification that offers Resolution at a Distance (RaaD), delivering large, flexible working distances while maintaining submicron resolution
  • Below 70 nm minimum achievable voxel
  • True spatial resolution <700 nm

Advanced Contrast Capabilities for Imaging Challenging Samples

  • Maximum discernibility with dual energy probing of properties generally indistinguishable within a single scan
  • Tunable propagation phase contrast to visualize low Z materials and biological samples that are likely to have limited absorption contrast
  • Enhanced absorption contrast detectors maximize collection of contrast-forming low energy X-ray photons that are crucial for imaging several material types

The Premier In Situ and 4D Solution

  • Images at high throughput in a large field of view can be obtained with Versa FPX, and then nondestructively sub-sample the region of interest with RaaD, all in one system
  • RaaD enables Xradia Versa to maintain high resolution because of the increase in space between the X-ray source and sample, and the resolution of standard micro-CT architecture degrades when samples are placed within spacious in situ chambers
  • Supporting a variety of in situ rigs for submicron imaging of samples up to inches in size within environmental chambers and under different conditions
  • Nondestructive X-ray microscopes uniquely characterize the microstructure of materials in simulated conditions - in situ - as well as the evolution of properties over time (4D)

Further Advantages

  • Autoloader option enables programming and running up to 14 samples at a time in order to maximize productivity, automate workflows for high volume scanning
  • Optional Versa In Situ Kit organizes the facilities that support environmental chambers, such as plumbing and wiring, to enable maximum imaging performance and ease set-up
  • Powerful dual GPU workstation accelerates image reconstruction time by up to 40%
  • System stability: low noise detector, thermal stabilization, vibrational isolation
  • Extremely simple control system for efficient workflows, suitable for a central lab-type setting where users may have a wide range of experience levels
  • Wide Field Mode (WFM) nearly 2X as wide as the conventional mode for larger field of view at resolution. Resulting 3D volumes are more than 3X larger

 

ZEISS Xradia 520 Versa 3D X-ray Microscope

Broken TSV
Brain Tissue
Limestone
Polymer Composite Matrix

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