The XM8000 Wafer X-ray Metrology Platform for Fast Automatic X-ray Measurement

The XM8000 Wafer X-ray Metrology Platform takes the key capabilities of Nordson DAGE’s existing X-ray systems to offer a fully automatic, high-throughput X-ray metrology and defect review system for optically visible and invisible features of 2.5D and 3D IC packages, wafer bumps, TSVs, and MEMS.

The XM8000 provides non-destructive, unprecedented, in-line wafer measurement of critical dimensions, voiding and fill levels, overlay and much more. In this way, the XM8000 platform can be used as an integral part of the packaging and fabrication of integrated circuits, or as part of product acceptance and quality control.

Advantages

  • High-throughput X-ray metrology and defect review of optically visible and hidden features of:
    • 2.5D & 3D IC packages
    • Wafer bumps
    • TSVs
    • MEMS
  • Industry standard handling of wafers - up to 300 mm
  • Non-destructive, in-line wafer measurement of critical dimensions, voiding and fill levels, overlay and much more
  • Non-standard substrate handling versions available

X-ray Technology

Nordson DAGE is the market leader in X-ray inspection for the electronics industry. It provides the XM8000 X-ray metrology platform for fast, automated, non-destructive measurement of, and within, metal features on up to 300 mm wafers.

The XM8000 also retains the key capabilities of Nordson DAGE’s existing X-ray systems, like the unique, filament-free, sealed-transmissive X-ray tube, and provides unprecedented levels of detection, precision, throughput, and automation. This allows the X-ray platform to be used as an integral part of the packaging and fabrication of integrated circuits, or as part of product acceptance and quality control.

The XM8000 X-ray metrology platform can rapidly measure the invisible, so there are no hidden surprises for customers.

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