The 4800 Bondtester from Nordson DAGE is at the forefront of wafer testing technology developed for testing wafers from 200 mm to 450 mm. While heralding progression in bond testing technology, the 4800 Bondtester’s heritage is built upon the success of the Nordson DAGE 4300.
The 4800 is a unique bondtester, as it utilizes the proven technology of the Nordson DAGE 4000Plus, the most advanced bondtester available on the market.
Flexible Wafer Map Creation
Nordson DAGE Paragon™ test software provides the ultimate flexibility for wafer map creation, enabling fast and precise set-up of test patterns; with virtual images for all test patterns making editing easy. Users can select the following methods: scan the wafer with the unique on-board intelligent automatic wafer mapping software; import wafer maps with industry standard formats; or use the simple mouse point and click wizard to set any test point anyplace on the wafer.
Successfully Test Warped and Thin Wafers
The edge lift smart chuck is uniquely designed. The edge lift pins keeps the warped or thin wafers from sliding off the chuck while the gradual vacuum pressure allows optimal vacuum on the wafer. The edge lift smart chuck features a built-in cross hair camera alignment target, pre-alignment accuracy, and integrated calibration.
Integrated wafer handling
When integrated with a wafer handler, the 4800 bondtester is transformed into a fully automatic system that ensures repeatable and reliable operation. This integration offers several advantages such as the automatic loading of thin, warped or bowed thick wafers, with clean contact at the wafer.
Unique Dual Microscope Mount
The combination of 4800 bondtester’s advanced optics and the microscope’s dual vibration reduction mount and flexible eye-line provides excellent image stability.
The unique multi-function cartridges increase the versatility of the 4800 bondtester. A variety of multi-function cartridges are also available; users can check with the factory for transducer combinations.
The cartridge window allows operators to easily identify which transducer is active when it is not in use, and the ‘Park Position’ protects the transducers within the cartridge.
An array of powerful camera and optical systems improve auto programming, load tool alignment, and post-test analysis.