FIB-SEM for High Throughput 3D Analysis and Sample Preparation

With ZEISS Crossbeam, users can benefit from a 3D nano-workstation. The analytical and imaging performance of a field emission scanning electron microscope (FE-SEM) can be combined with the processing ability of a focused ion beam (FIB). During imaging, milling, or when conducting 3D analytics, Crossbeam accelerates FIB applications. Users can make the most of their 3D analytics with the latest EDS module; exploit variable pressure capabilities with ZEISS Crossbeam 340; and employ Crossbeam 550 for their most challenging characterizations. The large chamber now comes with more number of options.

Advantages in FIB-SEM

Maximize Your SEM Insights

Users can achieve up to 30% better SEM resolution at low voltage.

Users can rely on the SEM performance of their ZEISS Crossbeam when conducting 3D tomography, or acquiring 2D surface sensitive images. By applying a voltage to the sample with Tandem decal, superior images from all types of samples can be achieved, all thanks to the Gemini optics with a resolution as low as 1.4 nm at 1 kV acceleration voltage. Samples can be fully characterized with a range of detectors. Pure materials contrast can be achieved using the advanced Inlens EsB detector, and non-conductive specimens can be studied undisturbed by charging artifacts.

Increase Your FIB Sample Throughput

The introduction of intelligent FIB milling strategies can lead to as much as 40% faster material removal.

Users can work with the highest ion beam current that is now provided in all gallium FIB-SEMs. Considerable amounts of time can be saved with excellent FIB profiles using up to 100 nA current without affecting the ultimate FIB resolution. Users can benefit from the precision and speed of intelligent FIB scanning strategies for material removal. In addition, they can automatically prepare batches of samples, like TEM lamellae, cross-sections, or any user-defined pattern.

Experience Best 3D Resolution in Your FIB-SEM Analysis

Integrated 3D EDS analysis provides significant benefits.

Users can expand the capacity of their Crossbeam with ZEISS Atlas 5 - the industry-leading package for precise and fast tomography. During tomography runs, EDS analysis can be carried out using the built-in 3D Analytics module of ZEISS Atlas 5. ZEISS Crossbeam integrates Gemini optics with a FIB customized for both speed and precision. Users can also benefit from leading isotropic voxel size and best 3D resolution in FIB-SEM tomography. Using the unique Inlens EsB detector, users can probe less than 3 nm in depth and create surface-sensitive, material-contrast images.

ZEISS Crossbeam: FIB-SEM for High Throughput 3D Analysis and Sample Preparation

High resolution at FIB-SEM coincidence

The point where the stage and SEM- and FIB beam join for FIB patterning, deposition or milling: Alumina nanospheres imaged at 1 kV with Tandem decel.

Cross-sectioning with 100 nA

The FIB column of the ZEISS Crossbeam Family is uniquely equipped with a beam current of 100 nA. This trench is milled in silicon, dimensions 100 × 30 × 25 μm³, milling time 10 minutes using 100 nA FIB current. Note the precision of the structure.

Comparison of milling strategies in silicon:

Material removal with convential milling (left) takes 10 min 54 sec whereas with Fastmill the same amount of material is removed in 7 min 21 sec (right). With Fastmill, a newly-introduced scanning strategy, milling speed is enhanced by optimally exploiting the angle-dependent sputtering effect. Fastmill enables up to 40% faster milling than regular line milling.

Precise sample preparation in a dense matrix

TEM-Lamella of a silver/nickel/copper-layered system ready for lift out, fabricated with automatic sample preparation.

Preparation of batches

Array of TEM lamellae fabricated with automated preparation.

EDS analysis at very high resolution with STEM

Chromium carbides at the grain boundary of thermally-affected X2CrNi18-10 steel: STEM BF (left), EDS chromium map (right).

Nanofluidic channels, master stamp

Nanofluidic channels, meander-shaped channels

Nanofluidic channels, funnel-shaped inlets and outlets

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