Two Component Medical Grade Epoxy - EPO-TEK® 301

EPO-TEK® 301 is a two component, room temperature curing, medical grade epoxy featuring extremely low viscosity and exceptional optical-mechanical properties.

Typical Properties: Cure condition: varies as needed *denotes test on lot acceptance basis Data below is not guaranteed. To be used as a guide only, not as a specification. Wide variety of batches, conditions and applications yield differing results.

Physical Properties

. .
* Color (before cure): Part A: Clear/Colorless
Part B: Clear/Colorless
* Consistency: Pourable liquid
* Viscosity (23 °C) @ 100 rpm: 100-200 cPs
Thixotropic Index: N/A
* Glass Transition Temp: ≥ 65 °C (Dynamic Cure: 20-200 °C/ISO 25 Min; Ramp -10-200 °C @ 20 °C/Min)
Coefficient of Thermal Expansion (CTE):
     Below Tg:
     Above Tg:

39 x 10-6 in/in °C
98 x 10-6 in/in °C
Shore D Hardness: 85
Lap Shear @ 23 °C: > 2,000 psi
Die Shear @ 23 °C: ≥ 10 Kg   3,400 psi
Degradation Temp: 430 °C
Weight Loss:
     @ 200 °C
     @ 250 °C
     @ 300 °C

Suggested Operating Temperature: < 300 °C (Intermittent)
Storage Modulus: 327,463 psi
* Particle Size: N/A

Electrical and Thermal Properties

Volume Resistivity @ 23 °C: ≥ 1 x 1013 Ohm-cm
Dielectric Constant (1 KHz): 4.00
Dissipation Factor (1 KHz): 0.016

Optical Properties @ 23 °C

. .
Spectral Transmission: ≥ 99% @ 382-980 nm
≥ 97% @ 980-1,640 nm
≥ 95% @ 1,640-2,040 nm
Index of Refraction: 1.519 @ 589 nm

EPO-TEK® 301 Advantages and Suggested Application Notes

  • NASA approved, low outgassing epoxy
  • Semiconductor: optical glob top or underfill; adhesion to common wafer passivation, compatible with LED die, Si, GaAs; solder mask and flex circuits.
  • PCB: general potting and protection over FR4, flex or ceramic PCBs.
  • Medical:
    • Compatible with CIDEX® OPA sterilization
    • Successfully passed 12 week implant study for biocompatibility
    • It is NONTOXIC - complies with ISO 10993 biocompatibility testing and certified for USP Class VI biocompatibility standards. Recommended for medical devices such as hand tooling, dental, catheters and endoscopic products; adhesion to stainless steel, titanium and most plastics; resisting sterilizing techniques like gamma, ETO and autoclave (65 °C/1 hour cure); resisting X-ray radiation; potting and protection of scintillator crystals; adhesive for the optical beam pathway in photo-diode arrays; CT Detector packaging.
  • Opto-electronic:
    • LCD/LED adhesive for laminating glass layers; general potting, encapsulation and protection; adhesion to PET plastic; spectral transmission in VIS and IR light; adhesive/encapsulant for VCSEL's packaged devices; resisting yellowing per ASTM D1925; adhesive for precision optics including lens, beam splitter cubes, prism, mirrors, and diodes, found in medical, university, or research communities.
  • Fiber Optic:
    • Adhesive for plastic and glass fibers; wicking into fiber bundles used in patch cords, sensor devices or endoscopes; adhesive/seal/encapsulant used for fiber packaging and components; transmission of IR up to 2500 nm; fiber coupling and splicing; terminating fibers into ferrules.

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