Two Component Epoxy Resin - EPO-TEK® 301-2

The EPO-TEK 301-2 is a two component medical, optical and semiconductor grade epoxy resin with long pot-life, good handling characteristics and low viscosity.

Typical Properties: Cure condition: 80 °C/3 Hours *denotes test on lot acceptance basis. Data below is not guaranteed. To be used as a guide, and not as a specification. Different batches, conditions and applications yield differing results.

Physical Properties

 
* Color (before cure): Part A: Clear/Colorless
Part B: Clear/Colorless
* Consistency: Pourable liquid
* Viscosity (23 °C) @ 100 rpm: 225 - 425 cPs
Thixotropic Index: N/A
* Glass Transition Temp: ≥ 80 °C (Dynamic Cure: 20-200 °C/ISO 25 Min; Ramp -10-200 °C @ 20 °C/Min)
Coefficient of Thermal Expansion (CTE):
     Below Tg:
     Above Tg:

61 x 10-6 in/in °C
180 x 10-6 in/in °C
Shore D Hardness: 80
Lap Shear @ 23 °C: > 2,000 psi
Die Shear @ 23 °C: ≥ 15 Kg   5,100 psi
Degradation Temp: 360 °C
Weight Loss:
     @ 200 °C
     @ 250 °C
     @ 300 °C

0.01%
0.46%
2.19%
Suggested Operating Temperature: < 300 °C (Intermittent)
Storage Modulus: 298,719 psi
Ion Content: Cl: 61 ppm
NA+: 104 ppm
NH4+: Not detectable
K+: Not detectable
Particle Size: N/A

Electrical and Thermal Properties:

. .
Thermal Conductivity: N/A W/mK
Volume Resistivity @ 23 °C: ≥ 2 X 1012 Ohm-cm
Dielectric Constant (1 KHz): 3.80
Dissipation Factor (1 KHz): 0.012

Optical Properties @ 23 °C:

. .
Spectral Transmission: ≥ 94% @ 300 nm
≥ 99% @ 400-1,200 nm
≥ 98% @ 1,200-1,600 nm
Index of Refraction: 1.5318 @ 589 nm

 

EPO-TEK® 301-2 Advantages and Suggested Application Notes

  • Ease of use: casting and potting, adhesive and encapsulation.
  • Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging
  • Fiber optic adhesive: terminating fiber into ferrule, bundling fibers, bonding glass cover slip over V-groove, adhesive for mounting optics inside fiber components; spectral transmission of visible and IR light
  • Compliant adhesive that will be resistant to vibrations or impact. Low stress adhesive for bonding optics within OEM/Scientific instruments
  • Biocompatible and Non-Toxic; Complies with ISO 10993 biocompatibility testing and certified for USP Class VI biocompatibility standards
  • Adhesion to glass, metals, wood, quartz and most plastics is very good
  • May also be used for impregnating porous or wooden objects for artifact restoration
  • NASA approved, low outgassing epoxy
  • Suggested for sealing of glass plates and LCD optical lamination. The product can resist yellowing over 17 days of nonstop UV light exposure. Ideal for LED encapsulation.

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