Solder Paste Inspection System with Maximum Speed Efficiency

The SE500-X™ from CyberOptics is a 100% 3D solder paste inspection system that pushes inspection speed to the maximum level possible. The SE500-X™ is capable of checking the most difficult assemblies with 80 cm2/second inspection speed without sacrificing measurement accuracy and repeatability.

Based on CyberOptics’ reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500-X™ can examine pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.

The SE500-X™ is built to assist users attain high quality solder joints in their SMT process through accurate volume measurement of each solder paste deposit every single time.

Key Features and Benefits

  • Large board handling – Capable of supporting large boards up to 810 x 612 mm
  • Fastest 3D SPI – 80 cm2/second inspection speed that does not sacrifice measurement accuracy and repeatability
  • Highly accurate SPI – Checks pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing lines speeds
  • Closed loop feedback ready – Supports closed loop feedback with major printers to optimize the solder printing process
  • Efficient warpage handling – Fitted with flexible circuit warp compensation algorithm to compensate for warp on intricate shapes
  • Excellent 3D measurement capability – Offers 3D height, volume and area measurements for PCBs with CSPs, 0201s, 01005s, micro-BGAs and other small pad sizes

Specifications

Board Size (Max.) 810 x 612 mm
Board Size (Min.) 100 x 100 mm
Inspection Speed @ 30 µm 80 cm2/sec
Inspection Speed @ 15µm 50 cm2/sec
Gage R&R <<10%, 6σ

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