The Picosun R-200 Advanced ALD System for R&D Applications

The PICOSUN™ R-200 Advanced ALD systems are designed for R&D on several applications such as IC components, LEDs, displays, lasers, MEMS devices, and 3D objects such as lenses, jewelry, coins, optics, and medical implants.

Technical Features

Typical substrate size and type

  • 3D objects
  • Mini-batch
  • Powders and particles
  • 50-200 mm single wafers
  • 156 mm x 156 mm solar Si wafers
  • Porous, through-porous, and high aspect ratio (up to 1:2500)

Processing temperature

  • 50 – 500 °C, plasma 450 °C (650 °C with heated chuck on request)

Typical processes

  • Al2O3, SiO2, HfO2, Ta2O5, ZnO, ZrO2, AlN, TiO2, TiN, metals such as Pt or Ir

Substrate loading

  • Manual loading with a pneumatic lift
  • Cassette-to-cassette loading with cluster tools
  • Semi-automatic loading with handling robot
  • Load lock with magnetic manipulator arm

Precursors

  • Liquid, solid, ozone, gas, plasma
  • Up to 12 sources with six separate inlets (seven if the plasma option is selected)

Options

  • Cluster tools, RGA, UHV compatibility, roll-to-roll chamber, Picoflow™ diffusion enhancer, N2 generator, customized designs, gas scrubber, glove box integration for inert loading

The PICOSUN™ R-200 Advanced ALD system is the international market leader in advanced ALD research tools with numerous customer installations. It has become the preferred tool both for companies and research institutes focused on innovation.

The agile design enables the maximum quality ALD film depositions along with the maximum system flexibility to suit future requirements and applications. The patented hot-wall design with completely separate inlets and instrumentation enables particle-free processing adaptable on a broad range of materials on 3D objects, wafers, and all nanoscale features. Exceptional uniformity even on the toughest through-porous, ultra-high aspect ratio, and nanoparticle samples is attained thanks to Picosun’s proprietary Picoflow™ technology.

The PICOSUN™ R-200 Advanced systems are fitted with extremely functional and easily exchangeable precursor sources for gaseous, liquid, and solid chemicals. Extremely efficient and patented remote plasma option enables deposition of metals without the risk of plasma damage or short-circuiting. Integration with glove boxes, manual and automated loaders, UHV systems, cluster tools, roll-to-roll chambers, powder chambers, and various in situ analytics systems enable efficient and flexible research with good results regardless of what the research area is currently or might become later on.

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