CMP Conditioners - Diamonex® Phoenix Pad Conditioners

The Diamonex patented CMP conditioners are based on a unique process in which diamond grit is bonded to a substrate using Chemical Vapor Deposition (CVD) to deposit diamond over the grit. This process provides superior diamond retention on an all-diamond surface by chemically bonding the diamond grit to the substrate.

Distinctive Design

The patented CMP conditioners use a Chemical Vapor Deposition (CVD) process to deposit a conformal layer of diamond over a proprietary ceramic substrate using an optimally-selected diamond grit. The resulting all-diamond surface provides superior diamond grit retention as the diamond grit is chemically bonded to the substrate. This all-diamond surface differs from conventional conditioners, as it is also chemically inert to all CMP slurries, preventing grit pullout caused by corrosion or wear. The CVD diamond layer also possesses high hardness and doesn’t wear down to the bare diamond crystals, preventing mechanical erosion of the bond matrix.


CMP conditioners are made up of three components: a substrate, a bond matrix, and diamond grit. CMP conditioners products and their resultant performances are differentiated by the method of manufacture and material selection.

The Bond Matrix

The diamond grit adheres to the substrate surface using the bond matrix. Metallic bonding is used by conventional conditioners. There are four types of metallic bonds: electroless Nickel, electroplated Nickel, brazed and sintered. All of these metal bond matrices have one inherent weakness: their limited hardness results in erosion. All metallic bond matrices are also prone to corrosion by low pH slurries and chemical attack. Morgan Advanced Materials is the only manufacturer using CVD diamond as the bond matrix, resulting in improved erosion and corrosion resistance on Phoenix conditioners.

In conventional conditioners, diamond grit is imbedded into the bond matrix, limiting the diamond grit and uniformity and protrusion. The Phoenix CVD diamond bond matrix is different as the diamond grit is encapsulated,  providing maximum diamond exposure with remarkable uniformity for any chosen diamond grit size.

The Substrate

Typically, conventional conditioners use a stainless steel substrate. Phoenix conditioners use a proprietary ceramic substrate developed by Morgan Advanced Materials. The proprietary ceramic substrate allows better design flexibility in features, size, and shape, while preserving tight dimensional tolerances.

The Diamond Grit

Phoenix conditioners use an improved diamond grit.  This high-quality low-inclusion blocky diamond crystal material results in diamond crystals with the maximum fracture toughness, and prevents any diamond breakage. The combination of high-quality diamond grit and high-strength molecular diamond bonding removes the possibility of wafer scratching as a result of diamond grit pullout or through the generation of diamond grit fragments.  

Phoenix conditioners have been designed to provide the greatest percentage of working grit (the percentage of diamond grit that actually makes contact with the pad) available. The amount of “working grit” on the surface is maximised by maintaining uniform diamond exposure and using an extremely flat substrate, resulting in more stable conditioner performance, as the percentage of diamond grit does not dramatically  change during the life of the conditioner.  


Extended Conditioner Life

The high working grit percentage of the Phoenix conditioner results in longer conditioner life and more gradual decay of the pad cut rate.

Consistent Conditioner Performance

The Diamonex product range uses advanced quality control systems during raw material selection and process control to provide consistent conditioners, resulting in excellent process repeatability. These features allow a consistent material removal rate throughout the life of the conditioner and conditioner-to-conditioner.

Corrosion-Resistant Materials

As the our Diamonex Phoenix CMP conditioner embodies pure diamond on a ceramic substrate, it provides excellent compatibility with the wafer fabrication process, practically eliminating chemical interactions between conditioner and slurry.

Superior Diamond Retention

During the CVD diamond process, a diamond molecular bond is created between the CVD diamond film, the ceramic substrate and the diamond grit. This diamond bonding minimizes the potential for grit-induced wafer scratches and the possibility of grit pullout.  Degradation of the strength of the bond resulting from erosion and corrosion does not occur for the Phoenix conditioners due to the high hardness and the inertness of the all-diamond working surface.

Customized Designs

Morgan Advanced Materials Technical Ceramics business offers a range of conditioner designs including standard 4” and 2” diameter conditioners. In addition, designs are available for larger diameter ring conditioners, as well as dual-sided conditioners for hard disk drive manufacturing processes.

Conditioning Disks Available

Conditioner Model Dimensions CMP Tools
Phoenix 2" Conditioners 2" diameter x 0.15" thick Lam Teres, IPEC 372/472
Phoenix 4" Conditioners 4" diameter x 0.19" thick AMAT, IPEC 372/472, Strasbaugh, Novellus
Phoenix 10" Conditioners Ebara 200 mm

Process Flexibility

Phoenix conditioners with the all-diamond surface can be used  in-situ or ex-situ in all CMP processes such as tungsten, tantalum, copper and oxide.

CMP Conditioners - Diamonex® Phoenix Pad Conditioners

Distinctive Design
Diamond Grit-1
Diamond Grit-2
Diamond Grit-3

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